KMPC8560CVT667JB

IC MPU MPC85XX 667MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)

Quantity 712 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8560
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN3A001A3Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case783-BFBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed667MHzSupplier Device Package783-FCPBGA (29×29)
Voltage – I/O2.5V, 3.3V

Overview of KMPC8560CVT667JB – PowerPC e500 667 MHz Microprocessor, 783-FCPBGA

The KMPC8560CVT667JB is a single-core, 32‑bit PowerPC e500 microprocessor running at 667 MHz. It integrates Power Architecture processing with system logic and communication peripherals designed for embedded networking, telecommunications, and wireless infrastructure applications.

As a member of the PowerQUICC III family with industrial qualification and RoHS compliance, this device delivers a compact, surface-mount solution in a 783‑FCPBGA (29×29) package for designs requiring integrated communications, memory interfaces, and wide operating temperature support.

Key Features

  • Core PowerPC e500 32‑bit processor core running at 667 MHz with 32 KB L1 instruction cache and 32 KB L1 data cache (parity protected) as documented for the MPC85xx family.
  • Communications Co-processor (CPM) Integrated Communications Processor Module (CPM) for communications tasks; CPM in the MPC8560 family operates at up to 333 MHz and maintains PowerQUICC III software compatibility.
  • Memory Controllers On-chip support for DDR and SDRAM memory controllers to interface with external system memory.
  • Ethernet Two 10/100/1000 Mbps Ethernet MACs for triple-speed LAN connectivity and system-level networking integration.
  • System Interfaces Integrated interfaces and controllers described for the MPC8560 family, including PCI/PCI‑X, RapidIO, local bus, I2C, JTAG and DMA support for diverse embedded I/O and system management.
  • Package & Mounting 783‑FCPBGA supplier device package (29×29), surface-mount mounting type suitable for compact embedded board designs.
  • Operating Range & Qualification Industrial qualification with operating temperature from −40 °C to 105 °C for deployment in temperature-demanding environments.
  • Regulatory RoHS compliant, supporting environmental and lead‑free assembly requirements.

Typical Applications

  • Network Routers and Switches Integrated Gigabit Ethernet MACs and CPM support make the KMPC8560CVT667JB suitable for line‑card processors and embedded switching/control functions.
  • Telecommunications Equipment PowerQUICC III system logic and communications peripherals enable protocol handling and system control in telecom infrastructure modules.
  • Wireless Infrastructure The combination of a PowerPC e500 core, CPM, and high‑speed I/O supports baseband control and infrastructure management tasks.
  • Industrial Embedded Systems Industrial temperature rating and robust package options fit embedded controllers and industrial communication gateways.

Unique Advantages

  • Highly integrated communications On‑chip CPM and multiple high‑speed interfaces reduce external component count and simplify board-level design for networked systems.
  • Proven PowerQUICC III architecture Part of the MPC8560/PowerQUICC III family, leveraging documented processor features and system-level support for embedded communications.
  • Dual Gigabit Ethernet Two 10/100/1000 Mbps MACs provide native triple‑speed Ethernet connectivity for multi‑port network designs.
  • Industrial temperature range Rated from −40 °C to 105 °C to meet the demands of harsh operating environments.
  • Compact BGA package 783‑FCPBGA (29×29) surface-mount package enables dense, space-constrained PCB layouts.
  • RoHS compliant Supports lead‑free manufacturing and environmental compliance requirements.

Why Choose KMPC8560CVT667JB?

The KMPC8560CVT667JB combines a 667 MHz PowerPC e500 core with integrated communications logic and high‑speed interfaces from the PowerQUICC III family to address embedded networking, telecom, and wireless infrastructure designs. Its industrial qualification, broad interface set (Ethernet, DDR/SDRAM, PCI/PCI‑X, RapidIO, I2C), and compact 783‑FCPBGA package make it a strong fit for systems that require integrated communications capabilities and a robust operating temperature range.

This device is appropriate for engineering teams seeking a single‑chip solution that reduces board complexity while providing documented architecture and system‑level support aligned with the MPC8560 specifications.

Request a quote or submit your RFQ to evaluate the KMPC8560CVT667JB for your next embedded communications design.

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