KMPC852TCVR100A
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 558 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC852 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 100MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| Voltage – I/O | 3.3V |
Overview of KMPC852TCVR100A – IC MPU MPC8XX 100MHZ 256BGA
The KMPC852TCVR100A is a single‑core 32‑bit microprocessor featuring the MPC8xx PowerPC architecture. It integrates a PowerPC‑based core with a Communication Processor Module (CPM) and system integration features to support embedded networking and communications applications.
Designed for control and networking tasks, the device targets Ethernet control products and other embedded systems that benefit from an integrated communications controller, a 100 MHz core, and industrial temperature capability.
Key Features
- Core & Architecture The MPC8xx 32‑bit PowerPC core runs at up to 100 MHz and includes instruction and data caches and MMU functionality as part of the MPC8xx family architecture.
- Performance 100 MHz core frequency with support for an external bus up to 66 MHz, enabling balanced CPU and bus throughput for embedded control tasks.
- Power & I/O Voltage 1.8 V core operation with 3.3 V I/O; documented 3.3 V I/O operation and 5 V TTL compatibility for interfacing with common legacy logic levels.
- Communications & CPM Integrated Communication Processor Module (CPM) and communications co‑processor functionality to handle communications protocols and offload packet processing.
- Memory & Bus Integrated DRAM controller and a 32‑bit internal bus architecture to support system memory and peripheral data paths.
- Interfaces Additional interfaces include HDLC/SDLC support and a 10 Mbps Ethernet interface (1), suitable for embedded network connectivity.
- Package & Mounting Supplied in a 256‑pin PBGA (23 × 23 mm) package, optimized for surface‑mount assembly and high pin‑count system integration.
- Operating Range & Qualification Industrial qualification with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
Typical Applications
- CPE and Access Equipment Implements control and packet handling tasks for customer premises equipment and network access devices.
- Ethernet Routing and Switching Suited for Ethernet routers and hubs where integrated communications processing and a dedicated CPM accelerate network functions.
- VoIP Clients Provides processing and communications interfaces needed for embedded VoIP endpoint designs.
- WiFi Access Points Acts as a control and communications processor for wireless access point systems requiring integrated network I/O.
- Industrial Control & Networking Industrial‑rated temperature range and surface‑mount 256‑PBGA package for industrial embedded controllers with networking needs.
Unique Advantages
- Integrated Communications Subsystem: The on‑chip CPM and communications co‑processor reduce external peripheral requirements and simplify BOM for networked designs.
- Power Domain Separation: 1.8 V core with 3.3 V I/O and 5 V TTL compatibility enables flexible interfacing while maintaining lower core power operation.
- Industrial Temperature Qualification: Rated for −40 °C to 100 °C, supporting deployments in demanding environmental conditions.
- High Pin Count PBGA Package: 256‑pin PBGA (23 × 23 mm) offers the I/O density required for complex embedded systems while supporting surface‑mount assembly.
- Documented Hardware Specifications: Hardware specifications and PowerQUICC family references are available for system integration, power sequencing, and layout best practices.
Why Choose KMPC852TCVR100A?
The KMPC852TCVR100A combines a PowerPC‑based MPC8xx core with an integrated communications processor and DRAM controller to deliver a compact, documented solution for embedded networking and control applications. Its 100 MHz core, 66 MHz external bus support, and CPM integration make it suitable for designs that require on‑chip communications handling and reliable industrial operation.
This device is ideal for engineers building Ethernet‑centric embedded products, VoIP clients, access points, and industrial controllers who need a single‑chip microprocessor with communications capabilities, industrial temperature range, and a high‑density PBGA package.
Request a quote or submit a parts inquiry to receive pricing and availability for KMPC852TCVR100A and to discuss volume requirements or lead times.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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