KMPC852TVR100A

IC MPU MPC8XX 100MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 256-PBGA (23x23)

Quantity 313 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC852
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN3A001A3Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed100MHzSupplier Device Package256-PBGA (23×23)
Voltage – I/O3.3V

Overview of KMPC852TVR100A – IC MPU MPC8XX 100MHZ 256BGA

The KMPC852TVR100A is a single-core 32-bit microprocessor based on the MPC8xx PowerPC architecture, manufactured by NXP Semiconductors as part of the MPC852 series. This device integrates a processor core, system integration functions and a communications processor module (CPM) to address embedded communications and Ethernet control applications.

Targeted for consumer-grade embedded designs, the KMPC852TVR100A delivers 100 MHz core operation with a feature set optimized for Ethernet CPE, routers, VoIP clients and Wi‑Fi access points where on-chip communication peripherals and DRAM controller integration simplify system design.

Key Features

  • Core & Architecture MPC8xx 32-bit core, single‑core processor running at 100 MHz; PowerPC architecture with on-chip instruction and data caches and memory management units as documented for the MPC8xx family.
  • External Bus Support External bus operation supported to 66 MHz, enabling connection to common system memory and peripherals at standard bus rates.
  • Communications & Coprocessor Integrated Communications Processor Module (CPM) for communications handling and DSP-style communications support, plus HDLC/SDLC interface support for serial link protocols.
  • Memory Controllers On-chip DRAM controller capability to interface with external system memory without a separate memory-controller IC.
  • Ethernet Interface Built-in Ethernet capability specified as 10 Mbps (single interface) for networked embedded applications.
  • Dual-Voltage I/O 1.8 V core operation with 3.3 V I/O and documented 5 V TTL compatibility for straightforward integration with mixed-voltage designs.
  • Package & Mounting 256‑ball PBGA package (23 × 23 mm), surface‑mount form factor for compact board implementations.
  • Operating Range & Qualification Consumer-grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance for environmental compatibility.

Typical Applications

  • Customer Premises Equipment (CPE) — Embedded Ethernet control and communications processing for CPE devices where integrated communications peripherals streamline board design.
  • Ethernet Routers and Hubs — Control-plane processing and protocol handling with on-chip CPM and HDLC/SDLC support for packet and link management.
  • VoIP Clients — Communications-centric processing for voice-over-IP endpoint devices leveraging the integrated CPM and network interface.
  • Wi‑Fi Access Points — Embedded control and management functions for access points that require integrated memory and communications support.

Unique Advantages

  • Integrated Communications Subsystem: On-chip CPM and HDLC/SDLC interfaces provide dedicated communications handling to offload protocol processing from the main CPU.
  • Memory Interface Integration: Built-in DRAM controller reduces external component count and simplifies memory subsystem design.
  • Mixed-Voltage Compatibility: 1.8 V core with 3.3 V I/O and 5 V TTL compatibility facilitates interfacing with a wide range of legacy and modern peripherals.
  • Compact PBGA Packaging: 256‑ball PBGA (23×23 mm) enables a high-pin-count, space-efficient implementation for dense embedded boards.
  • RoHS Compliant: Meets RoHS environmental requirements for use in regulated markets.
  • Consumer-Grade Temperature Range: Specified operation from 0 °C to 95 °C suitable for many consumer and commercial embedded deployments.

Why Choose KMPC852TVR100A?

The KMPC852TVR100A positions itself as a compact, communications‑focused embedded processor that combines a 100 MHz MPC8xx core with an integrated communications processor module, DRAM controller, and standard serial link interfaces. This integration supports streamlined BOMs and board layouts for networked consumer devices.

Designers building Ethernet CPE, routers, VoIP endpoints or Wi‑Fi access points will find the KMPC852TVR100A well suited to applications requiring on-chip communications support, mixed-voltage I/O compatibility, and consumer-grade operating range backed by NXP Semiconductor product documentation.

Request a quote or submit a procurement inquiry for the KMPC852TVR100A to obtain pricing and availability information tailored to your volume and delivery requirements.

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