KMPC8560PX833LC

IC MPU MPC85XX 833MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29)

Quantity 1,438 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8560
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A991B4BEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BFBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed833MHzSupplier Device Package783-FCPBGA (29×29)
Voltage – I/O2.5V, 3.3V

Overview of KMPC8560PX833LC – IC MPU MPC85XX 833MHZ 783FCPBGA

The KMPC8560PX833LC is an NXP Semiconductors PowerPC e500 microprocessor device from the MPC8560 series, featuring a single 32-bit core running at 833 MHz in a 783-FCPBGA package (29×29). It integrates on-chip system logic and communication subsystems intended for networking, telecommunications and wireless infrastructure embedded applications.

Designed as a member of the PowerQUICC III family, this device emphasizes system integration for high-throughput interfaces and embedded control, with support for DDR/SDRAM memory, multi-speed Ethernet, and a Communications Processor Module (CPM) for communications offload.

Key Features

  • Core: PowerPC e500 32-bit processor core at 833 MHz with embedded MMU and hardware debug support.
  • On-chip caches: 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and line-locking capability.
  • Communications Processor (CPM): High-performance RISC CPM (software-compatible within PowerQUICC families) operating up to 333 MHz to handle communications tasks.
  • Memory controllers: Integrated support for DDR and SDRAM memory types for system memory interfacing.
  • Ethernet connectivity: Dual 10/100/1000 Mbps Ethernet interfaces with three-speed MII management.
  • Peripheral interfaces: I2C and JTAG support plus on-chip controllers for PCI/PCI‑X and RapidIO as documented for the MPC8560 family.
  • Package & mounting: 783-FCPBGA supplier device package (29×29), surface-mount.
  • Operating temperature: Rated for 0 °C to 105 °C for consumer-qualified applications.
  • Compliance: RoHS compliant.
  • Graphics: No graphics acceleration included.

Typical Applications

  • Networking equipment: Use the dual 10/100/1000 Mbps Ethernet interfaces and integrated communications logic for routers, switches and aggregation devices.
  • Telecommunications infrastructure: Leverage the CPM and high-speed interfaces for line card controllers, base station controllers and protocol offload tasks.
  • Wireless infrastructure: Integrate the MPC8560 into wireless backhaul or gateway platforms requiring embedded processing and multi‑gigabit connectivity.
  • Embedded control systems: Deploy as an embedded MPU in systems that require a single high-performance 32-bit core with robust memory and peripheral support.

Unique Advantages

  • Integrated communications subsystem: The on-chip CPM and communications-focused peripherals reduce external controllers and simplify BOM for networking and telecom designs.
  • Balanced processing and offload: A single 833 MHz PowerPC e500 core paired with a CPM up to 333 MHz enables partitioning of application and protocol processing.
  • Rich I/O and bus support: On-chip controllers and documented support for PCI/PCI‑X and RapidIO allow flexible system architectures without excessive external logic.
  • Memory flexibility: DDR and SDRAM controller support facilitates a range of memory configurations to match performance and cost targets.
  • Proven architecture: Member of the PowerQUICC III family with Power Architecture™ technology and embedded-focused MMU and debug features for predictable integration.
  • Manufacturing and environmental readiness: Surface-mount 783-FCPBGA package and RoHS compliance aid modern assembly flows and regulatory alignment.

Why Choose KMPC8560PX833LC?

The KMPC8560PX833LC delivers a focused embedded processing platform that combines a PowerPC e500 32-bit core at 833 MHz with a CPM and the system logic expected in PowerQUICC III devices. Its combination of integrated memory controllers, multi-speed Ethernet, peripheral interfaces and on-chip communications processing helps simplify board design while enabling robust networking and telecom functionality.

This part is suited for engineering teams building embedded networking, telecommunications or wireless infrastructure equipment that need a single-core PowerPC solution with extensive communications support and documented hardware features for system-level integration.

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