KMPC8560VT833LB

IC MPU MPC85XX 833MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29)

Quantity 513 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8560
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN3A001A3Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BFBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed833MHzSupplier Device Package783-FCPBGA (29×29)
Voltage – I/O2.5V, 3.3V

Overview of KMPC8560VT833LB – PowerPC e500 833 MHz, 1-Core, 783-FCPBGA

The KMPC8560VT833LB is an NXP Semiconductors embedded microprocessor built around a PowerPC e500 core running at 833 MHz. It combines a high-performance 32-bit Book E–enhanced core with integrated system logic tailored for networking, telecommunications and wireless infrastructure applications.

Designed as a member of the PowerQUICC III family, this device delivers a compact, highly integrated solution for embedded communications platforms that require on-chip memory interfaces, multiple Ethernet MACs and a communications processor module (CPM) for protocol handling.

Key Features

  • Core and Architecture  PowerPC e500 32-bit Book E–enhanced core delivering 833 MHz performance with embedded-oriented MMU and debug/performance monitoring facilities.
  • Memory Subsystem  Integrated support for DDR and SDRAM memory controllers to meet common embedded memory interface requirements.
  • Communications Processor (CPM)  On-chip CPM for communications and protocol offload; CPM operation documented for compatibility within the PowerQUICC family.
  • Ethernet Connectivity  Two integrated 10/100/1000 Mbps Ethernet MACs for three-speed networking in embedded systems.
  • Peripheral Interfaces  Additional interfaces include I2C and support for standard embedded bus controllers such as local bus, PCI/PCI‑X and RapidIO as documented in the integrated device specification.
  • Package and Mounting  Supplied in a 783‑FCPBGA surface‑mount package (29 × 29 mm) suitable for compact system designs.
  • Operating Range  Rated for operation from 0 °C to 105 °C for consumer‑grade embedded deployments.
  • Compliance  RoHS‑compliant for environmental regulatory alignment.

Typical Applications

  • Network Routers and Switches  Use the integrated dual gigabit MACs and on-chip CPM to implement packet forwarding, management and control plane functions.
  • Telecommunications Equipment  Suited for line cards and subsystem controllers that require embedded Power Architecture processing and communications offload.
  • Wireless Infrastructure  Ideal for base station controllers and wireless backhaul devices where integrated memory interfaces and protocol processing are needed.
  • Embedded Communications Platforms  Deploy in systems that benefit from on-chip DMA, local bus, and high-speed peripheral interconnects for streamlined board-level design.

Unique Advantages

  • Integrated Communications Processing: On-chip CPM provides dedicated resources for protocol handling and communications tasks, reducing external subsystem complexity.
  • Dual Gigabit Ethernet MACs: Two 10/100/1000 Mbps MACs enable flexible networking topologies and high-throughput data paths without additional PHY-facing logic.
  • Embedded‑Oriented Core Features: PowerPC e500 core includes MMU, cache structures and debug/performance monitoring facilities tailored for embedded system development and optimization.
  • Flexible Memory Support: DDR and SDRAM controller support simplifies memory subsystem design for a range of performance and cost targets.
  • Compact, Surface‑Mount Packaging: The 783‑FCPBGA (29×29 mm) package supports high‑pin count integration in space-constrained designs.
  • RoHS Compliant: Meets RoHS environmental requirements for regulatory and supply‑chain alignment.

Why Choose KMPC8560VT833LB?

The KMPC8560VT833LB positions itself as a focused embedded communications processor that balances single‑core PowerPC e500 performance with rich on‑chip system logic for networking and telecommunications applications. Its integrated CPM, dual gigabit MACs and memory controller support reduce bill‑of‑materials and simplify system architecture for embedded designers.

This device is suitable for teams building consumer‑qualified embedded communications equipment that require robust networking features, compact packaging and supplier‑documented system-level support within the PowerQUICC III family. The combination of integration and documented hardware features helps accelerate development and system validation.

Request a quote or submit a parts inquiry to check availability and pricing for KMPC8560VT833LB. Include your required quantity and delivery timeline to receive a prompt response.

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