KMPC8560VT833LB
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 513 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8560 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | PowerPC e500 | Device Package | 783-FCPBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 783-BFBGA, FCBGA | RAM Controllers | DDR, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 833MHz | Supplier Device Package | 783-FCPBGA (29×29) | ||
| Voltage – I/O | 2.5V, 3.3V |
Overview of KMPC8560VT833LB – PowerPC e500 833 MHz, 1-Core, 783-FCPBGA
The KMPC8560VT833LB is an NXP Semiconductors embedded microprocessor built around a PowerPC e500 core running at 833 MHz. It combines a high-performance 32-bit Book E–enhanced core with integrated system logic tailored for networking, telecommunications and wireless infrastructure applications.
Designed as a member of the PowerQUICC III family, this device delivers a compact, highly integrated solution for embedded communications platforms that require on-chip memory interfaces, multiple Ethernet MACs and a communications processor module (CPM) for protocol handling.
Key Features
- Core and Architecture PowerPC e500 32-bit Book E–enhanced core delivering 833 MHz performance with embedded-oriented MMU and debug/performance monitoring facilities.
- Memory Subsystem Integrated support for DDR and SDRAM memory controllers to meet common embedded memory interface requirements.
- Communications Processor (CPM) On-chip CPM for communications and protocol offload; CPM operation documented for compatibility within the PowerQUICC family.
- Ethernet Connectivity Two integrated 10/100/1000 Mbps Ethernet MACs for three-speed networking in embedded systems.
- Peripheral Interfaces Additional interfaces include I2C and support for standard embedded bus controllers such as local bus, PCI/PCI‑X and RapidIO as documented in the integrated device specification.
- Package and Mounting Supplied in a 783‑FCPBGA surface‑mount package (29 × 29 mm) suitable for compact system designs.
- Operating Range Rated for operation from 0 °C to 105 °C for consumer‑grade embedded deployments.
- Compliance RoHS‑compliant for environmental regulatory alignment.
Typical Applications
- Network Routers and Switches Use the integrated dual gigabit MACs and on-chip CPM to implement packet forwarding, management and control plane functions.
- Telecommunications Equipment Suited for line cards and subsystem controllers that require embedded Power Architecture processing and communications offload.
- Wireless Infrastructure Ideal for base station controllers and wireless backhaul devices where integrated memory interfaces and protocol processing are needed.
- Embedded Communications Platforms Deploy in systems that benefit from on-chip DMA, local bus, and high-speed peripheral interconnects for streamlined board-level design.
Unique Advantages
- Integrated Communications Processing: On-chip CPM provides dedicated resources for protocol handling and communications tasks, reducing external subsystem complexity.
- Dual Gigabit Ethernet MACs: Two 10/100/1000 Mbps MACs enable flexible networking topologies and high-throughput data paths without additional PHY-facing logic.
- Embedded‑Oriented Core Features: PowerPC e500 core includes MMU, cache structures and debug/performance monitoring facilities tailored for embedded system development and optimization.
- Flexible Memory Support: DDR and SDRAM controller support simplifies memory subsystem design for a range of performance and cost targets.
- Compact, Surface‑Mount Packaging: The 783‑FCPBGA (29×29 mm) package supports high‑pin count integration in space-constrained designs.
- RoHS Compliant: Meets RoHS environmental requirements for regulatory and supply‑chain alignment.
Why Choose KMPC8560VT833LB?
The KMPC8560VT833LB positions itself as a focused embedded communications processor that balances single‑core PowerPC e500 performance with rich on‑chip system logic for networking and telecommunications applications. Its integrated CPM, dual gigabit MACs and memory controller support reduce bill‑of‑materials and simplify system architecture for embedded designers.
This device is suitable for teams building consumer‑qualified embedded communications equipment that require robust networking features, compact packaging and supplier‑documented system-level support within the PowerQUICC III family. The combination of integration and documented hardware features helps accelerate development and system validation.
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