KMPC860TCVR50D4

The KMPC860TCVR50D4 is a PowerQUICC-family embedded microprocessor based on the MPC8xx/MPC860 architecture. It integrates a single 32‑bit core running at 50 MHz with on‑chip system logic targeted at communications and networking applications.

Designed for industrial environments, this device combines a communications processor module (CPM), DRAM memory controller, multiple Ethernet ports and standard serial interfaces in a compact 357‑PBGA (25×25) surface‑mount package, with 3.3 V I/O and an operating temperature range of −40 °C to 95 °C.

Key Features

• Core  Single MPC8xx 32‑bit core at 50 MHz; implements Power Architecture technology with memory management support and on‑chip instruction/data cache features documented for the MPC860 family.
• Communications Processor (CPM)  Integrated CPM for communications and protocol handling, enabling offload of serial and packet tasks to dedicated co‑processor resources.
• Ethernet Connectivity  Multiport Ethernet support with four 10 Mbps ports and one 10/100 Mbps port for mixed-speed network designs.
• Memory Support  On‑chip DRAM controller to interface with external DRAM; the MPC860 family also includes a PCMCIA socket controller capability in the documented feature set.
• I/O and Serial Interfaces  HDLC/SDLC support and multiple communications interfaces provided via the CPM for protocol and serial link implementations.
• Power and Mounting  3.3 V I/O signaling and surface‑mount 357‑PBGA (25×25) package for compact board integration.
• Industrial Qualification  Specified for industrial use with operating temperature range of −40 °C to 95 °C and RoHS compliance.

Typical Applications

• Networking Equipment  Multiport Ethernet connectivity and CPM offload make this device suitable for routers, switches and network controllers handling mixed‑speed links.
• Communications Controllers  Integrated serial protocol support (HDLC/SDLC) and CPM resources allow efficient implementation of protocol stacks and link interfaces.
• Industrial Embedded Systems  Industrial temperature rating and DRAM controller support are suited for factory automation, protocol gateways and field controllers.
• Telecommunications Infrastructure  The combination of Ethernet ports and communications co‑processing supports telecom control and service edge devices.

Unique Advantages

• Integrated communications subsystem: CPM plus serial and HDLC/SDLC interfaces reduce external logic and simplify protocol implementations.
• Multiple Ethernet ports: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible network topologies without additional MAC controllers.
• Industrial temperature capability: −40 °C to 95 °C rating supports deployment in harsh and industrial environments.
• Compact, surface‑mount package: 357‑PBGA (25×25) allows high‑density board layouts for space‑constrained designs.
• 3.3 V I/O compatibility: Standard voltage level simplifies interfacing to common low‑voltage peripherals and memory.
• RoHS compliant: Meets lead‑free regulatory requirements for contemporary manufacturing.

Why Choose KMPC860TCVR50D4?

The KMPC860TCVR50D4 positions itself as a compact, industrially rated communications microprocessor that brings core processing, DRAM interfacing and a dedicated communications processor together with multiple Ethernet interfaces. Its PowerQUICC‑family heritage and documented on‑chip features make it well suited for embedded networking, telecom and industrial control designs that require integrated protocol handling and mixed‑speed Ethernet connectivity.

For design teams seeking a single‑chip solution with a documented feature set—covering system memory interface, CPM communications resources and industrial temperature operation—this part offers a practical balance of integration and proven architecture for long‑lifecycle embedded applications.

Request a quote or submit an inquiry to receive pricing and availability for KMPC860TCVR50D4. Our team can provide lead‑time details and support for procurement and integration planning.