 | | XC2765X104F80LRABKXUMA1 | Infineon Technologies | IC MCU 16/32B 832KB FLSH 100LQFP | Microcontrollers | PG-LQFP-100-8 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 832KB (832K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-8 Package / Case: 100-LQFP Exposed Pad | 987 | |
 | | XC2765X72F80LAAKXUMA1 | Infineon Technologies | IC MCU 16/32B 576KB FLSH 100LQFP | Microcontrollers | PG-LQFP-100-8 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 576KB (576K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-8 Package / Case: 100-LQFP Exposed Pad | 1,551 | |
 | N/A | XC2766X96F66LACKXUMA1 | Infineon Technologies | IC MCU 16/32B 768KB FLSH 100LQFP | Microcontrollers | PG-LQFP-100-3 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-3 Package / Case: 100-LQFP Exposed Pad | 157 | |
 | N/A | XC2768X136F128LRAAKXUMA1 | Infineon Technologies | IC MCU 16/32BIT 1.06MB 100LQFP | Microcontrollers | PG-LQFP-100-8 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.06MB (1.06M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-8 Package / Case: 100-LQFP Exposed Pad | 268 | |
 | | XC2785X104F80LAAKXUMA1 | Infineon Technologies | IC MCU 16/32B 832KB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-4 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 832KB (832K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-4 Package / Case: 144-LQFP Exposed Pad | 19 | |
 | | XC2785X104F80LRABKXUMA1 | Infineon Technologies | IC MCU 16/32B 832KB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-4 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 832KB (832K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-4 Package / Case: 144-LQFP Exposed Pad | 971 | |
 | N/A | XC2786X96F66LACKXUMA1 | Infineon Technologies | IC MCU 16/32B 768KB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-4 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-4 Package / Case: 144-LQFP Exposed Pad | 71 | |
 | N/A | XC2787X200F100LABKXUMA1 | Infineon Technologies | IC MCU 16/32B 1.6MB FLSH 144LQFP | Microcontrollers | PG-LQFP-144-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.6MB (1.6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-13 Package / Case: 144-LQFP Exposed Pad | 327 | |
 | N/A | XC2788X136F128LRAAKXUMA1 | Infineon Technologies | IC MCU 16/32BIT 1.06MB 144LQFP | Microcontrollers | PG-LQFP-144-13 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.06MB (1.06M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-13 Package / Case: 144-LQFP Exposed Pad | 1,706 | |
 | | XC2797X200F100LABKXUMA1 | Infineon Technologies | IC MCU 16/32B 1.6MB FLSH 176LQFP | Microcontrollers | PG-LQFP-176-12 | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI Peripherals: I2S, POR, PWM, WDT Program Memory Size: 1.6MB (1.6M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 30x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-12 Package / Case: 176-LQFP Exposed Pad | 744 | |
 | | XC2S100-5FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 161 | |
 | | XC2S100-5FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,767 | |
 | | XC2S100-5FG456C | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,304 | |
 | | XC2S100-5FG456I | Advanced Micro Devices | IC FPGA 196 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 592 | |
 | | XC2S100-5FGG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,122 | |
 | | XC2S100-5FGG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 384 | |
 | | XC2S100-5PQ208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 181 | |
 | | XC2S100-5PQ208I | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 917 | |
 | | XC2S100-5PQG208C | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 81 | |
 | | XC2S100-5PQG208I | Advanced Micro Devices | IC FPGA 140 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 1,571 | |