UCD1C681MNS1GS

The UCD1C681MNS1GS is a Nichicon chip-type aluminum electrolytic capacitor engineered for surface-mount applications that require low impedance and compact size. With a capacitance of 680 µF at 16 V, a wide operating temperature range of −55°C to 105°C, and AEC‑Q200 qualification, it is suited for demanding electronic systems including automotive and high-density PCB designs.

This SMD can-style capacitor delivers high ripple handling, long endurance, and packaging compatible with automated assembly (embossed carrier taping), making it appropriate for power smoothing and decoupling in space-constrained assemblies.

Key Features

• Capacitance & Voltage — 680 µF rated at 16 V for bulk energy storage and decoupling in low-voltage power rails.
• Low Impedance Type — Chip-type, low-impedance construction specified for surface-mount use to support stable performance under ripple stress.
• Tolerance & Loss — Capacitance tolerance −20% to +20%; tangent of loss angle (tan δ) 0.16 measured at 20°C, 120 Hz.
• Ripple Current Performance — Low-frequency ripple current 425 mA (120 Hz) and high-frequency ripple current 850 mA (10 kHz) for effective smoothing across a range of switching frequencies.
• Leakage Current — Specified leakage current 108.8 µA after rated-voltage application at 20°C.
• High Temperature Endurance — Rated for 5,000 hours at 105°C (endurance conditions specified), supporting long-term reliability in elevated-temperature environments.
• Wide Operating Temperature — −55°C to +105°C for use across harsh ambient conditions.
• Compact SMD Can Package — Size φ10 × 10L (1.0 × 1.0 cm), surface-mount radial can form factor with surface-mount land size 1.03 × 1.03 cm.
• Assembly-Friendly Packaging — Supplied in embossed carrier taping for automated pick-and-place mounting; vibration resistant.
• Standards & Compliance — AEC‑Q200 qualified and RoHS compliant; product is in mass production.

Typical Applications

• Automotive Electronics — Bulk smoothing and decoupling in electronic control modules where AEC‑Q200 qualification and high-temperature endurance are required.
• Power Supply Modules — Output filtering and hold-up capacitance in compact SMD power converters and point-of-load regulators.
• High-Density PCB Designs — Surface-mount chip can provides high capacitance in a 1.0 × 1.0 cm footprint for space-constrained board layouts.

Unique Advantages

• High Capacitance in a Compact SMD — 680 µF in a φ10 × 10L can provides substantial energy storage where board space is limited.
• Designed for High Ripple Environments — Specified ripple currents at both low and high frequency (425 mA @120 Hz, 850 mA @10 kHz) support stable filtering across switching regimes.
• High-Temperature Durability — 5,000-hour endurance at 105°C reduces maintenance and replacement in elevated-temperature applications.
• Automotive-Grade Qualification — AEC‑Q200 qualification supports use in automotive electronic systems that require industry-recognized component reliability.
• Automated Assembly Ready — Embossed carrier taping and vibration resistance simplify integration into high-volume SMT production lines.
• Regulatory Compliance — RoHS compliant to meet environmental and regulatory requirements.

Why Choose UCD1C681MNS1GS?

UCD1C681MNS1GS combines a high 680 µF capacitance with low-impedance chip construction and a compact SMD can package, delivering robust ripple handling and long-term performance in tight board spaces. Its −55°C to 105°C operating range, 5,000-hour endurance at 105°C, and AEC‑Q200 qualification make it a practical choice for engineers designing reliable power systems for automotive and industrial electronics.

This part is targeted at designs that demand durable, high-capacitance surface-mount capacitors with automated-assembly compatibility and verifiable performance data for temperature, ripple, and leakage characteristics.

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