UCD1E150MCL1GS

The UCD1E150MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting in compact, high‑density printed circuit board assemblies. It delivers 15 µF capacitance at a 25 V rating in a φ5 × 5.8 mm package, optimized for automated placement and carrier‑tape production.

With an operating temperature range from −55 °C to +105 °C, AEC‑Q200 qualification, and endurance of 2000 hours at 105 °C, this part is intended for demanding applications that require stable decoupling and filtering in constrained form factors.

Key Features

• Core Construction – Chip type, low impedance Designed for SMD use with low impedance characteristics suitable for decoupling and smoothing on compact boards.
• Electrical Performance 15 µF nominal capacitance at a rated voltage of 25 V, with capacitance tolerance of −20% to +20% and impedance of 700 mΩ.
• Loss and Leakage Low dissipation factor (tan δ = 0.14 measured at 20 °C, 120 Hz, 25 V) and low leakage current specified at 3.75 µA.
• Ripple Handling Rated ripple current of 80 mA at 120 Hz (low frequency) and 160 mA at 10 kHz (high frequency) to support dynamic loads.
• Temperature & Endurance Wide operating range from −55 °C to +105 °C and specified endurance of 2000 hours at 105 °C for long‑term reliability.
• Package & Mounting Compact φ5 × 5.8 mm can‑style SMD package with recommended PCB land size of 5.3 × 5.3 mm; supplied in embossed carrier taping for automated assembly.
• Qualification & Compliance AEC‑Q200 rated and RoHS compliant, supporting use in regulated and quality‑driven designs.

Typical Applications

• Automotive electronics — AEC‑Q200 qualification and 105 °C endurance make this capacitor suitable for automotive control modules and auxiliary electronics requiring a 25 V SMD capacitor.
• High‑density PCB assemblies — Small φ5 × 5.8 mm footprint and SMD can package fit tight layouts where board space is limited.
• Automated manufacturing — Supplied in embossed carrier taping compatible with automatic placement equipment for efficient high‑volume assembly.

Unique Advantages

• Compact low‑impedance option: 15 µF in a φ5 × 5.8 mm SMD can with 700 mΩ impedance for space‑constrained designs needing effective filtering.
• High temperature endurance: Rated to operate to +105 °C with a 2000‑hour endurance rating at that temperature for sustained performance in hot environments.
• Low loss and leakage: tan δ of 0.14 (25 V, 120 Hz, 20 °C) and 3.75 µA leakage support stable performance in precision power circuits.
• Designed for automated assembly: Embossed carrier taping and surface‑mount land size (5.3 × 5.3 mm) streamline pick‑and‑place and reflow workflows.
• Automotive‑grade qualification: AEC‑Q200 rating provides traceable quality and suitability for regulated automotive applications.

Why Choose UCD1E150MCL1GS?

The UCD1E150MCL1GS combines a compact SMD can footprint with low impedance, controlled loss, and low leakage to meet the needs of high‑density, temperature‑challenging designs. Its 25 V rating, measured ripple handling, and 2000‑hour endurance at 105 °C make it a practical choice for engineers specifying reliable decoupling and filtering components.

Targeted at designers and procurement teams building automotive and industrial electronics, this part offers a balance of electrical performance, thermal endurance, and assembly readiness, backed by AEC‑Q200 qualification and RoHS compliance.

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