UCD1E220MCL1GS

The UCD1E220MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can designed for high-density PCB assembly. It delivers 22 µF at 25 V with low loss (tanδ 0.14 at 120 Hz, 20 °C) and specified ripple performance for demanding power decoupling and filtering tasks.

Qualified to AEC-Q200 and rated for operation from −55 °C to 105 °C, this part targets automotive and industrial electronic modules that require a compact, robust SMD electrolytic solution compatible with automated assembly (embossed carrier taping) and volume production.

Key Features

• Capacitance & Voltage 22 µF nominal capacitance with a rated voltage of 25 V and tolerance −20% to +20%, suitable for decoupling and bulk hold-up in low-voltage systems.
• Low Impedance Designed as a low-impedance chip-type SMD capacitor with specified impedance of 700 mΩ and tanδ of 0.14 (120 Hz, 20 °C) to reduce voltage drop and improve transient response.
• Ripple & Leakage Low-frequency ripple current 80 mA (120 Hz) and high-frequency ripple current 160 mA (10 kHz) with a leakage current of 5.5 µA, enabling stable operation under AC ripple conditions.
• Temperature & Endurance Operating temperature range −55 °C to 105 °C with an endurance rating of 2000 hours at 105 °C for sustained high-temperature reliability.
• Package & Mounting Compact dimensions φ5 × 5.8 mm (L: 5.8 × D: 5 mm) in a surface-mount can with recommended land size 5.3 × 5.3 mm; supplied in embossed carrier taping for automated pick-and-place.
• Automotive-Grade Qualification AEC-Q200 qualified and manufactured for mass production, making it suitable for automotive electronics where that qualification is required.
• RoHS Compliance Compliant with RoHS requirements for environmental and regulatory conformance.

Typical Applications

• Automotive Electronics — Suitable for surface-mount use in automotive electronic modules that require AEC-Q200-qualified capacitors for power decoupling and smoothing.
• Power Filtering on Dense PCBs — Compact chip form factor and low impedance make it appropriate for high-density boards where board space and ripple handling are constrained.
• Industrial Control Modules — Designed for automated assembly (embossed carrier taping) and long-term operation up to 105 °C, fitting industrial power and control applications.

Unique Advantages

• Compact SMD Can — φ5 × 5.8 mm size provides high capacitance in a small footprint for space-constrained designs.
• Low Loss, Improved Transient Response — Low tanδ and specified low impedance help reduce voltage ripple and improve system stability under dynamic load.
• Defined Ripple Handling — Separate low- and high-frequency ripple current ratings (80 mA @120 Hz, 160 mA @10 kHz) let designers match the part to expected operating conditions.
• Automated-Assembly Ready — Supplied in embossed carrier tape for reliable pick-and-place and high-throughput production workflows.
• High-Temperature Endurance — Rated for 2000 hours at 105 °C, supporting designs that must sustain elevated operating temperatures.
• AEC-Q200 Qualified — Qualification aligned to automotive standards for use in applications requiring that level of component qualification.

Why Choose UCD1E220MCL1GS?

The UCD1E220MCL1GS combines compact SMD packaging with low impedance and clearly defined ripple and leakage characteristics to support reliable power decoupling and filtering on dense PCBs. Its −55 °C to 105 °C operating range, 2000-hour endurance at 105 °C, and AEC-Q200 qualification make it a suitable choice for automotive and industrial designs that demand durability and automated assembly compatibility.

Manufactured by Nichicon and available in mass-production quantities with embossed carrier taping, this capacitor delivers a practical balance of size, electrical performance, and production readiness for engineers specifying electrolytic SMD solutions.

Request a quote or contact sales to discuss pricing, lead times, and volume availability for UCD1E220MCL1GS.