UCD1E221MNS1GS

The UCD1E221MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly on high-density PC boards. It delivers 220 µF at a 25 V rating with performance optimized for applications requiring high ripple handling, wide temperature range, and long endurance.

Targeted for demanding electronics, including automotive systems, this SMD capacitor combines AEC-Q200 qualification, vibration resistance, and embossed carrier taping for automatic placement to support volume production and robust field performance.

Key Features

• Capacitance & Voltage — 220 µF nominal capacitance with a 25 V rated voltage and ±20% tolerance, suitable for bulk storage and decoupling in compact SMD form.
• Low Impedance Performance — Low loss tangent (tan δ) of 0.14 measured at 20°C, 120 Hz (for 25 V rating), delivering reduced impedance at operating frequencies.
• High Ripple Handling — Specified low-frequency ripple current of 300 mA at 120 Hz and high-frequency ripple current of 600 mA at 10 kHz for effective AC ripple absorption across a range of frequencies.
• Leakage Current — Leakage current specified at 55 µA, supporting predictable standby and no-load behavior in power circuits.
• Extended Endurance — Rated for 5000 hours at 105°C, providing long-term stability for high-temperature environments.
• Automotive-Grade Reliability — AEC-Q200 qualified and vibration resistant, aligning with automotive and other rugged electronics requirements.
• Compact SMD Package — φ8 × 10 mm can-style chip in a surface-mount package with recommended land pattern 8.3 × 8.3 mm; provided in embossed carrier tape for automatic mounting.
• Wide Temperature Range & Compliance — Operates from −55°C to +105°C and is RoHS compliant.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and vibration resistance make the part suitable for in-vehicle power systems and electronics modules that require durable SMD capacitors.
• High-Density PCBs — Chip-type SMD design and embossed carrier taping support automated placement on compact, high-density circuit boards.
• Power Management & Filtering — 220 µF capacitance combined with specified ripple current ratings and low tan δ supports bulk decoupling and smoothing in power supply sections.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q200 qualification provides a verified baseline for use in regulated vehicle electronics and other demanding applications.
• Long-Term High-Temperature Endurance: 5000 hours at 105°C supports reliable operation in elevated-temperature environments.
• Balanced Ripple Performance: Separate low- and high-frequency ripple ratings (300 mA @120 Hz, 600 mA @10 kHz) give designers clear parameters for AC performance across frequency ranges.
• Space-Efficient SMD Form Factor: φ8 × 10 mm chip design with SMD packaging enables high-density board layout while retaining substantial capacitance.
• Production-Ready Packaging: Supplied in embossed carrier tape for compatibility with automatic placement equipment, simplifying assembly at scale.
• Wide Operating Range: −55°C to +105°C operating range and RoHS compliance make the component versatile across environmental conditions.

Why Choose UCD1E221MNS1GS?

UCD1E221MNS1GS combines a high-capacitance, low-impedance chip design with automotive-grade qualification and vibration resistance, offering a compact solution for power management on dense SMD boards. Its clear ripple current ratings, controlled leakage, and long endurance at 105°C make it well suited to designers who need predictable performance under thermal and mechanical stress.

This part is ideal for teams developing robust power modules, automotive electronics, and compact high-density assemblies where long-term reliability, automated assembly, and verified qualification are key selection criteria.

Request a quote or contact sales to discuss volume pricing, lead times, and availability for UCD1E221MNS1GS.