UCD1E221MNL1GS

The UCD1E221MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount use on high‑density PCBs. With a nominal capacitance of 220 µF and a 25 V rated voltage, it delivers board‑level bulk capacitance and ripple handling in a compact radial can SMD package.

Targeted at demanding electronic assemblies including automotive systems (AEC‑Q200 qualified), this part combines elevated temperature endurance with embossed carrier taping for automated placement, making it suitable for production environments that require reliable, high‑density power decoupling and smoothing.

Key Features

• Capacitance and Voltage — 220 µF nominal capacitance with a rated voltage of 25 V and a tolerance of −20% to +20% for predictable bulk energy storage.
• Low Loss / Low Impedance — Tangent of loss angle (tan δ) of 0.14 measured at 20°C, 120 Hz, providing low dissipation for power applications.
• Ripple Current Capability — Low‑frequency ripple current of 300 mA (120 Hz) and high‑frequency ripple current of 600 mA (10 kHz) to support both line‑frequency and switching supply noise filtering.
• Leakage Current — Specified leakage current of 55 µA for stable idle behavior in precision circuits.
• High‑Temperature Endurance — Rated for operation from −55°C to +105°C with a 5000‑hour endurance rating at 105°C, supporting long life in elevated temperature environments.
• Compact SMD Package — φ8 × 10L radial can SMD package with recommended land size 8.3 × 8.3 mm for dense board layouts; supplied on embossed carrier tape for automated assembly.
• Quality and Compliance — AEC‑Q200 qualified and RoHS compliant, aligning with industry quality expectations for regulated environments.

Typical Applications

• Automotive Electronics — Bulk smoothing and decoupling in electronic control modules where AEC‑Q200 qualification and high‑temperature endurance are required.
• High‑Density Power Modules — Board‑level energy storage and ripple suppression on compact PCBs designed for space‑constrained power supplies.
• Automated Production Lines — Supplied in embossed carrier tape for compatibility with automatic mounting machines and high‑volume assembly.

Unique Advantages

• AEC‑Q200 Qualification: Provides traceable component quality for applications requiring recognized automotive stress‑test pedigree.
• Robust Thermal Endurance: 5000 hours at 105°C enables extended operational life in high‑temperature environments.
• High Ripple Handling: Dual ripple ratings (300 mA @120 Hz and 600 mA @10 kHz) offer versatility across both line‑frequency and switching noise conditions.
• Compact Surface‑Mount Form Factor: φ8 × 10L radial can SMD package and defined land pattern support high‑density PCB designs while enabling automated placement.
• Low Loss Performance: tan δ of 0.14 at 20°C, 120 Hz supports efficient energy handling with controlled dissipation.
• Production‑Ready Packaging: Embossed carrier taping and mass‑production status streamline procurement and assembly integration.

Why Choose UCD1E221MNL1GS?

UCD1E221MNL1GS positions itself as a reliable, compact solution for designers who need board‑level bulk capacitance with proven thermal endurance and automotive‑grade qualification. Its combination of low impedance, defined ripple capabilities, and AEC‑Q200 qualification make it well suited to robust power and control electronics operating up to 105°C.

Choose this part when you require a surface‑mount aluminum electrolytic capacitor that supports automated assembly, offers predictable electrical characteristics (220 µF, 25 V, specified tan δ and leakage), and integrates into high‑density PCB layouts while meeting industry compliance expectations.

If you need pricing, lead‑time information, or a formal quotation for UCD1E221MNL1GS, please request a quote or contact our sales team to start the procurement process.