UCD1E270MCL1GS

The UCD1E270MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It combines a compact SMD can package (φ6.3 × 5.8 mm) with performance characteristics targeted at dense PCB assemblies and automated production.

Key attributes include a 27 µF capacitance at 25 V, wide operating temperature range from −55°C to 105°C, AEC-Q200 qualification, and embossed carrier taping for pick-and-place compatibility—making it suitable for demanding electronics environments, including automotive applications.

Key Features

• Core Type Chip-type aluminum electrolytic capacitor optimized for surface-mount installation on high-density PCBs.
• Capacitance & Tolerance 27 µF nominal with tolerance −20% to +20% (±20% at 120 Hz, 20°C).
• Rated Voltage 25 V nominal rating for a wide range of low-voltage power applications.
• Low Impedance Performance Specified impedance of 360 mΩ and tangent of loss angle (tanδ) of 0.14 (measured at 20°C, 120 Hz) to support effective decoupling in compact power circuits.
• Ripple Current Capability Low-frequency ripple current 120 mA at 120 Hz and high-frequency ripple current 240 mA at 10 kHz for AC filtering and smoothing tasks.
• Leakage Current Typical leakage current 6.75 µA under rated conditions for predictable bias behavior.
• Temperature & Endurance Operating temperature −55°C to +105°C with rated endurance of 2000 hours at 105°C (rated conditions).
• Package & Mounting Surface-mount, radial can style (φ6.3 × 5.8L), polar capacitor with recommended land size 6.6 × 6.6 mm and supplied in embossed carrier taping for automated assembly.
• Standards & Compliance AEC-Q200 rated and RoHS compliant.

Typical Applications

• Automotive Electronics Suited for automotive electronic modules where AEC-Q200 qualification and a −55°C to +105°C temperature range are required.
• High-Density Surface-Mount Assemblies Compact chip can package (φ6.3 × 5.8 mm) designed for space-constrained PCBs and high component density.
• Automated Production Embossed carrier taping and SMD form factor enable efficient placement with automatic mounting equipment.

Unique Advantages

• Compact SMD Can Small footprint (φ6.3 × 5.8 mm) helps conserve board area without sacrificing capacitance.
• Low Impedance, Stable Loss Characteristics 360 mΩ impedance and tanδ 0.14 (20°C, 120 Hz) provide reliable AC performance for decoupling and filtering.
• Broad Temperature Range with High-Temperature Endurance −55°C to +105°C rating and 2000 hours endurance at 105°C deliver predictable long-term behavior in elevated-temperature environments.
• Automotive-Grade Qualification AEC-Q200 rating supports use in automotive electronic applications that require component-level qualification.
• Assembly-Ready Packaging Embossed carrier taping facilitates high-throughput automated placement and consistent soldering results.
• Low Leakage Leakage current of 6.75 µA supports stable bias conditions in sensitive circuits.

Why Choose UCD1E270MCL1GS?

UCD1E270MCL1GS is positioned for designers who need a compact, surface-mount aluminum electrolytic capacitor with low impedance, robust thermal endurance, and qualification for automotive applications. Its combination of 27 µF capacitance at 25 V, measurable low-loss characteristics, and embossed carrier taping make it a practical choice for dense PCB layouts and automated assembly flows.

With a −55°C to +105°C operating range, AEC-Q200 rating, and defined ripple and leakage specifications, this part delivers predictable electrical behavior and durability for designs that require reliable power smoothing and decoupling over extended high-temperature operation.

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