UCD1E330MCL1GS

The UCD1E330MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It is offered as an SMD radial can suitable for automated assembly and carrier-tape feed.

Targeted for automotive and other demanding applications, this capacitor combines a 33 µF / 25 V rating with AEC-Q200 qualification, RoHS compliance, and a wide operating temperature range to provide reliable decoupling and ripple handling in compact assemblies.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance at a rated voltage of 25 V.
• Low Impedance — Specified impedance of 360 mΩ to support low-impedance decoupling and filtering.
• Tolerance & Polarization — Capacitance tolerance ±20% (at 120 Hz, 20°C); polarized electrolytic construction.
• Temperature & Endurance — Operating temperature range −55°C to +105°C with a specified lifetime of 2000 hours at +105°C.
• Ripple Current Performance — Rated ripple current of 120 mA at 120 Hz and 240 mA at 10 kHz, enabling effective ripple handling across common frequencies.
• Surface-Mount Package — Chip-type radial can SMD package; footprint size L: 5.8 × D: 6.3 mm and recommended land size 6.6 × 6.6 mm for high-density PCBs.
• Assembly Compatibility — Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines fed with carrier tape.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and wide temperature range make the capacitor suitable for automotive electronic modules and subsystems.
• High-Density PCB Assemblies — Chip-type SMD package and compact footprint support decoupling and filtering in space-constrained, densely populated boards.
• Power Supply Filtering — Low impedance and specified ripple current ratings enable effective smoothing and noise reduction in compact power stages.

Unique Advantages

• AEC-Q200 Qualified: Provides an established qualification for use in automotive-grade electronic designs where that standard is required.
• High Temperature Endurance: Rated for operation up to +105°C with a specified 2000-hour lifetime at +105°C, supporting reliability in elevated-temperature environments.
• Low-Impedance Performance: 360 mΩ impedance helps minimize voltage drop and improve transient response in decoupling applications.
• SMD Chip Form Factor: Small L: 5.8 × D: 6.3 mm package and 6.6 × 6.6 mm land pattern enable automated assembly and efficient use of board area.
• Carrier-Tape Compatible: Designed for automatic mounting machines fed with carrier tape to streamline high-volume production.
• Regulatory Compliance: RoHS conformity for use in regulated assemblies and global markets.

Why Choose UCD1E330MCL1GS?

UCD1E330MCL1GS combines a compact SMD chip package with low impedance, defined ripple-current capability, and AEC-Q200 qualification to address compact, high-reliability designs. Its temperature range (−55°C to +105°C) and specified endurance at elevated temperature make it appropriate for assemblies that require sustained operation in demanding environments.

This capacitor is well suited to engineers specifying compact decoupling and filtering components for automotive and other high-density electronic modules where automated assembly, robust temperature performance, and recognized qualification are required.

Request a quote or contact sales to discuss availability, lead times and pricing for UCD1E330MCL1GS.