UCD1E330MCL6GS
| Part Description |
33 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,745 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.8 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 700 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 160 mA @ 10 kHz | Ripple Current Low Frequency | 80 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UCD1E330MCL6GS – Chip‑Type Low‑Impedance SMD Aluminum Electrolytic Capacitor, 33 µF, 25 V
The UCD1E330MCL6GS is a chip‑type, low‑impedance aluminum electrolytic capacitor optimized for surface‑mount assembly on high‑density PCBs. It delivers 33 µF of capacitance at a 25 V rating in a compact φ5 × 5.8 mm package with embossed carrier taping for automated placement.
Designed for demanding operating conditions, the part supports a wide temperature range from −55 °C to +105 °C, AEC‑Q200 qualification, and a 2000‑hour endurance rating at 105 °C—making it suitable where robustness, predictable lifetime, and SMD assembly compatibility are required.
Key Features
- Capacitance & Tolerance — 33 µF nominal capacitance with tolerance of −20% to +20% (measured at 120 Hz, 20 °C).
- Rated Voltage — 25 V DC rating for medium‑voltage SMD applications.
- Low Impedance Performance — Specified impedance of 700 mΩ and tangent of loss angle (tan δ) of 0.14 (measured at 20 °C, 120 Hz) for reduced AC losses.
- Ripple Current Capability — Low‑frequency ripple current of 80 mA at 120 Hz and high‑frequency ripple current of 160 mA at 10 kHz to support AC stress handling within the specified ratings.
- Leakage Current — Specified leakage current of 8.25 µA for predictable standby and bias behavior.
- Temperature & Endurance — Operating range from −55 °C to +105 °C with endurance rated at 2000 hours at 105 °C.
- SMD Package & Mounting — Chip type, radial can (SMD) package sized φ5 × 5.8 mm with surface‑mount land recommendation of 5.3 × 5.3 mm; supplied in embossed carrier taping for automatic mounting machines.
- Compliance & Production — RoHS compliant and AEC‑Q200 qualified; part is in mass production.
Typical Applications
- Automotive Electronics — AEC‑Q200 qualification and wide temperature operation make this capacitor suitable for control modules and electronic assemblies used in automotive environments.
- High‑Density SMD Power Modules — Chip‑type SMD form factor and embossed carrier taping support automated placement on compact, high‑density PCBs.
- Compact Power Filtering — 33 µF capacitance combined with low impedance and defined ripple current ratings supports space‑constrained designs requiring stable bulk capacitance.
- Industrial Control Electronics — Endurance at elevated temperature and low leakage enable reliable use in industrial control and power management circuitry.
Unique Advantages
- Low‑Impedance Design: 700 mΩ impedance and a tan δ of 0.14 (120 Hz, 20 °C) reduce AC losses and improve effective filtering in compact layouts.
- Automotive‑Grade Qualification: AEC‑Q200 rating provides documented qualification for automotive electronic applications.
- Wide Temperature and Endurance: −55 °C to +105 °C operating range with 2000 hours endurance at 105 °C supports long‑term reliability under thermal stress.
- SMD Assembly Ready: Chip‑type radial can in embossed carrier taping enables efficient placement on automated pick‑and‑place lines for high‑volume manufacturing.
- Predictable Leakage and Ripple Performance: Specified leakage current (8.25 µA) and ripple current ratings (80 mA @ 120 Hz, 160 mA @ 10 kHz) make behavior under bias and AC stress verifiable during design.
- Compact Footprint: φ5 × 5.8 mm package with recommended land size 5.3 × 5.3 mm minimizes board area while providing 33 µF bulk capacitance.
Why Choose UCD1E330MCL6GS?
The UCD1E330MCL6GS balances compact SMD packaging with low‑impedance electrical performance and documented endurance, making it a practical choice for designs that require reliable bulk capacitance in confined spaces. Its AEC‑Q200 qualification, wide temperature range, and mass production availability position it for applications where predictable lifetime and supply continuity matter.
This part is well suited to engineers specifying capacitors for automotive and industrial SMD assemblies that demand a combination of compact footprint, controlled electrical characteristics, and compatibility with automated PCB assembly.
If you need pricing, availability, or samples for design evaluation, request a quote or contact sales to discuss quantities, lead times, and technical assistance for integrating UCD1E330MCL6GS into your designs.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016