UCD1E471MNL1GS

The UCD1E471MNL1GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It provides 470 µF capacitance at a 25 V rating in a compact φ10 × 10L can suitable for high-density PCB layouts.

Built for reliability in demanding environments, this part is AEC-Q200 qualified, RoHS compliant, and supplied in embossed carrier taping for automated assembly. Key performance attributes include wide operating temperature (-55°C to 105°C), long endurance (5000 hours at 105°C), and defined ripple and leakage characteristics for robust power-stage use.

Key Features

• Capacitance & Voltage — 470 µF nominal capacitance with a rated voltage of 25 V and tolerance of -20% to +20% for bulk energy storage and decoupling.
• Low Impedance Construction — Chip-type, low-impedance design with a tangent of loss angle (tanδ) of 0.14 measured at 20°C, 120 Hz, to support stable performance in power applications.
• Ripple Current Capability — Low-frequency ripple current of 425 mA (120 Hz) and high-frequency ripple current of 850 mA (10 kHz) to handle switching and filtering loads.
• Leakage & Reliability — Specified leakage current of 117.5 µA and endurance rated to 5000 hours at 105°C, supporting long-term stability under elevated temperature stress.
• Thermal Range — Operates from -55°C to 105°C, enabling use across a wide temperature envelope.
• Package & Mounting — Surface-mount radial can (φ10 × 10L) with recommended land size L: 1.03 × W: 1.03 cm; supplied in embossed carrier taping for automated placement.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant; offered in mass-production status for volume designs.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and 5000 h endurance at 105°C make this capacitor suitable for automotive electronic modules that require robust bulk capacitance and high-temperature durability.
• High-Density Surface-Mount Power Assemblies — Chip-type SMD form factor and compact φ10 × 10L size are intended for use on high-density PCBs where board space and low impedance are important.
• Automated Volume Manufacturing — Supplied in embossed carrier taping and compatible with automatic mounting machines, facilitating efficient pick-and-place assembly for large-scale production.

Unique Advantages

• High Capacitance in a Compact SMD Can — 470 µF in a φ10 × 10L package delivers significant bulk energy storage while minimizing board footprint.
• Designed for Low Impedance Performance — Specified tanδ and ripple current ratings support stable filtering and smoothing in switching power stages.
• Long-Term High-Temperature Endurance — 5000 hours at 105°C rating provides assurance of performance under elevated temperature operating profiles.
• Automotive-Grade Qualification — AEC-Q200 qualification and an operating range to 105°C align the part with automotive electronics quality expectations.
• Manufacturing-Friendly Packaging — Embossed carrier taping allows straightforward integration into automated assembly lines for efficient production ramp.
• Compliance-Ready — RoHS compliance supports regulatory requirements for modern electronics manufacturing.

Why Choose UCD1E471MNL1GS?

UCD1E471MNL1GS is positioned for designs that require robust bulk capacitance, low impedance, and long-term reliability in a compact surface-mount package. Its combination of 470 µF at 25 V, defined ripple current ratings, and 5000-hour endurance at 105°C makes it well suited to power-stage and module-level applications where thermal and electrical stability are critical.

With AEC-Q200 qualification, embossed carrier taping for automated placement, and RoHS compliance, this Nichicon UCD series part supports scalable production and long-term deployment in demanding environments.

For pricing, availability, or to request a quote for UCD1E471MNL1GS, please contact sales to discuss volume pricing, lead times, or sample requests.