UCD1E471MNS1GS
| Part Description |
470 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 631 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 470 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.1 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 5000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 850 mA @ 10 kHz | Ripple Current Low Frequency | 425 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UCD1E471MNS1GS – 470 µF, 25 V Low‑Impedance SMD Aluminum Electrolytic Capacitor
The UCD1E471MNS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density printed circuit boards. It delivers 470 µF at 25 V in a compact φ10 × 10L SMD can, optimized for automated placement via embossed carrier taping.
Targeted for demanding electronic environments, this part offers wide operating temperature capability (−55 °C to +105 °C), AEC‑Q200 qualification, and long endurance (5,000 hours at 105 °C), making it suitable for automotive and other robust power applications that require high ripple tolerance and reliable performance.
Key Features
- Capacitance & Voltage — 470 µF rated capacitance at 25 V with ±20% tolerance, providing bulk energy storage and smoothing in power rails.
- Low Impedance Character — Chip‑type, low‑impedance design with a tangent of loss angle (tan δ) of 0.14 measured at 20 °C, 120 Hz, for efficient AC handling.
- High Ripple Current Capability — Supports 425 mA at 120 Hz (low frequency) and 850 mA at 10 kHz (high frequency), enabling effective ripple suppression across frequency ranges.
- Wide Temperature & Long Life — Rated for −55 °C to +105 °C with 5,000 hours endurance at 105 °C, suitable for prolonged operation in elevated temperatures.
- Automotive Grade Reliability — AEC‑Q200 qualified and vibration resistant, supporting demanding reliability requirements for vehicle electronics.
- Surface Mount Package — φ10 × 10L radial can, surface mount (can‑SMD) package with recommended land size L: 1.03 × W: 1.03 cm and supplied in embossed carrier taping for automated assembly.
- Leakage & Loss Characteristics — Specified leakage current of 117.5 µA and DF (tan δ) measured at industry standard conditions to aid predictable power‑system behavior.
- Regulatory Compliance — RoHS compliant, supporting environmental compliance requirements.
Typical Applications
- Automotive power systems — Bulk filtering and smoothing on vehicle power rails where AEC‑Q200 qualification and wide temperature range are required.
- Automotive power modules — Decoupling and ripple suppression in DC‑DC converters and power module outputs, leveraging high ripple current capability.
- Rugged on‑board electronics — Use in vibration‑resistant, high‑density SMD assemblies that demand long endurance at elevated temperatures.
Unique Advantages
- High ripple tolerance: Specified low‑ and high‑frequency ripple currents (425 mA at 120 Hz, 850 mA at 10 kHz) support robust filtering across a broad frequency range.
- Long endurance at elevated temperature: 5,000 hours rated life at 105 °C provides predictable long‑term performance in hot operating environments.
- Automotive qualification: AEC‑Q200 rating and vibration resistance address the reliability needs of automotive electronics designs.
- Compact SMD form factor: φ10 × 10L chip can and embossed carrier taping enable automated placement on high‑density PCBs, reducing assembly complexity.
- Predictable electrical behavior: Defined tan δ (0.14 at 20 °C, 120 Hz), leakage current, and ±20% capacitance tolerance simplify design margining and system modeling.
- RoHS compliance: Meets environmental directives for restricted substances.
Why Choose UCD1E471MNS1GS?
The UCD1E471MNS1GS combines a low‑impedance chip construction with high ripple capability, wide temperature range, and AEC‑Q200 qualification to meet the reliability and performance needs of demanding electronic systems. Its compact φ10 × 10L SMD can and embossed carrier taping are tailored for automated assembly on high‑density PCBs while providing the endurance required for prolonged operation at elevated temperatures.
This capacitor is well suited for designers and procurement teams building robust power supplies and on‑board electronics in automotive and other high‑reliability markets who require verifiable electrical characteristics, long life, and assembly‑friendly packaging.
Request a quote or submit a pricing inquiry to discuss availability, lead times, and volume pricing for UCD1E471MNS1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016