UCD1E560MCL1GS

The UCD1E560MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It provides 56 µF capacitance at a 25 V rating in a compact φ6.3 × 5.8 mm package optimized for high-density PCBs and automatic assembly.

Engineered for demanding environments, the device is AEC-Q200 qualified and RoHS compliant, with an operating temperature range of −55°C to 105°C and an endurance rating of 2000 hours at 105°C. Key electrical characteristics include low impedance (360 mΩ), low loss (tanδ 0.14 at 120 Hz, 20°C), and defined ripple/current and leakage performance for reliable board-level power management.

Key Features

• Chip-type, low impedance — Compact SMD form factor with an impedance of 360 mΩ to support low-impedance board designs.
• Capacitance and tolerance — 56 µF capacitance with ±20% tolerance at 120 Hz, 20°C.
• Voltage and loss characteristics — Rated for 25 V with tanδ of 0.14 measured at 120 Hz, 20°C for controlled dielectric loss.
• Ripple current capability — Low-frequency ripple current 120 mA (120 Hz) and high-frequency ripple current 240 mA (10 kHz) for AC stress handling.
• Leakage and endurance — Leakage current specified at 14 µA and life/endurance of 2000 hours at 105°C under rated voltage.
• Temperature and reliability — Wide operating temperature range from −55°C to 105°C and AEC-Q200 qualification for applications requiring component-level reliability.
• Surface-mount packaging — Radial, can-style SMD package (φ6.3 × 5.8 mm) supplied in embossed carrier taping for automated pick-and-place.

Typical Applications

• Automotive electronics — AEC-Q200 qualified and rated from −55°C to 105°C for use in automotive electronic modules that require surface-mounted, low-impedance capacitors.
• High-density PCB designs — Chip-type SMD package (φ6.3 × 5.8 mm) suited to compact board layouts and tight component placement.
• Automated assembly — Supplied on embossed carrier tape and applicable to automatic mounting machines for volume production.
• Board-level power decoupling — Low impedance, defined tanδ, and ripple current ratings make it suitable where stable AC performance and low loss are required.

Unique Advantages

• AEC-Q200 qualified: Provides the qualification level required for many automotive and reliability-focused projects.
• Compact, production-ready package: φ6.3 × 5.8 mm chip form factor and embossed carrier taping facilitate high-density layouts and automated assembly.
• Balanced electrical performance: 56 µF at 25 V with 360 mΩ impedance and tanδ 0.14 delivers a balance of capacitance, low loss, and predictable AC behavior.
• Thermal endurance: Rated for 2000 hours at 105°C to support long-term operation in elevated-temperature environments.
• Defined ripple and leakage specs: Specified low- and high-frequency ripple currents (120 mA / 240 mA) and 14 µA leakage current enable engineering trade-offs to be calculated precisely.

Why Choose UCD1E560MCL1GS?

The UCD1E560MCL1GS positions itself as a reliable, space-efficient SMD aluminum electrolytic capacitor for designs that demand stable, low-impedance capacitance in a compact package. Its AEC-Q200 qualification, broad temperature range (−55°C to 105°C), and defined endurance rating make it suitable for applications where long-term reliability and predictable electrical behavior are important.

With surface-mount compatibility, embossed carrier taping for automated placement, and clearly specified electrical parameters (capacitance, impedance, tanδ, ripple currents, and leakage), this part helps engineers simplify BOM decisions and integrate a tested capacitor option into production workflows.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for UCD1E560MCL1GS.