UCD1H100MCL1GS
| Part Description |
10 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,706 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 10 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.8 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 860 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 170 mA @ 10 kHz | Ripple Current Low Frequency | 85 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UCD1H100MCL1GS – Chip Type, Low Impedance
The UCD1H100MCL1GS is an aluminum electrolytic, chip-type capacitor engineered for surface-mount applications requiring low impedance and compact packaging. It is designed for automated assembly (carrier-tape compatible) and for mounting on high-density PCBs.
Key characteristics include a 50 V rated voltage, 10 µF capacitance, AEC-Q200 qualification, RoHS compliance, and an operating temperature range of -55 °C to +105 °C—making it suitable for demanding environments including automotive electronics.
Key Features
- Electrical Performance — Rated at 50 V with 10 µF capacitance and an impedance of 860 mΩ, offering stable filtering and decoupling in compact SMD designs.
- Tolerance & Polarization — Capacitance tolerance ±20% (at 120 Hz, 20 °C); polarized design for use in DC circuits.
- Temperature and Endurance — Operates from -55 °C to +105 °C with a specified lifetime of 2000 hours at 105 °C.
- Ripple Current Ratings — Rated ripple current of 85 mA at 120 Hz and 170 mA at 10 kHz for AC stress handling.
- Package & Mounting — Chip-type radial can in an SMD package sized L: 5.8 × D: 6.3 mm with recommended land size L: 6.6 × W: 6.6 mm for surface-mount assembly.
- Manufacturing Compatibility — Designed for automatic mounting machines and carrier-tape feeding to support high-volume assembly.
- Compliance & Qualification — RoHS compliant and AEC-Q200 qualified for applications that require established reliability standards.
Typical Applications
- Automotive Electronics — Suitable for electronic control modules and other automotive circuits that require components meeting AEC-Q200 qualification and high-temperature operation.
- High-Density Surface-Mount PCBs — Compact chip-type form factor for power filtering and decoupling where board space is constrained.
- Automated Assembly Production — Carrier-tape compatibility and SMD packaging streamline placement and throughput in automated manufacturing lines.
Unique Advantages
- AEC-Q200 Qualification: Provides a documented qualification level for use in applications where component reliability is required by industry standards.
- Low Impedance (860 mΩ): Helps reduce voltage ripple and improve stability in power-supply and decoupling circuits.
- High Temperature Endurance: Rated for continuous operation up to +105 °C with a 2000-hour specification at that temperature, supporting thermal durability in demanding environments.
- Compact SMD Radial Can: Small footprint (L 5.8 × D 6.3 mm) and defined land pattern (6.6 × 6.6 mm) preserve PCB area while enabling robust soldering and placement.
- Assembly-Ready: Designed for carrier-tape feeding and automatic placement, reducing assembly complexity and supporting high-volume production.
- Regulatory Compliance: RoHS compliance simplifies regulatory acceptance for commercial and industrial programs.
Why Choose UCD1H100MCL1GS?
The UCD1H100MCL1GS combines a low-impedance aluminum electrolytic architecture with compact SMD packaging and industry-level qualification, targeting applications that demand both space efficiency and reliable performance at elevated temperatures. Its rated voltage, ripple current specs, and AEC-Q200 qualification make it a practical choice for designers specifying robust capacitors for automotive and other high-reliability electronics.
This part is well suited to engineers and procurement teams building compact, production-ready assemblies that require automated placement, RoHS compliance, and documented endurance at up to +105 °C.
Request a quote or contact our sales team to discuss availability, lead times, and volume pricing for UCD1H100MCL1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016