UCD1H100MCL6GS

The UCD1H100MCL6GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor engineered for surface-mount applications. It delivers 100 µF at 50 V in a compact SMD package designed for high-density PCBs and automated assembly.

With an extended operating range from -55°C to 105°C, AEC-Q200 rating, and RoHS compliance, this capacitor is aimed at demanding designs requiring reliable bulk capacitance, ripple handling, and long-term endurance in challenging environments.

Key Features

• Capacitance & Voltage – 100 µF nominal capacitance with a rated voltage of 50 V and a tolerance of -20% to +20% for bulk energy storage and decoupling.
• Low Impedance Performance – Specified tangent of loss angle (tanδ) of 0.1 measured at 20°C, 120 Hz, supporting low-loss operation in power rails.
• Ripple Current Handling – Low-frequency ripple current of 45 mA (120 Hz) and high-frequency ripple current of 90 mA (10 kHz) to address both mains-frequency and switching-frequency noise.
• Leakage Current – Low leakage current rated at 5 µA for stable standby characteristics.
• Temperature & Endurance – Wide operating temperature range from -55°C to 105°C and rated endurance of 2000 hours at 105°C for long-term reliability.
• Package & Mounting – Chip-type surface-mount can (φ6.3 × 7.7L) supplied in embossed carrier taping compatible with automatic mounting machines; surface-mount land size guidance available.
• Automotive-Grade Qualification – AEC-Q200 rated for use in applications that require automotive-level qualification.
• Regulatory Compliance – RoHS compliant.

Typical Applications

• Automotive Electronics – Use for bulk decoupling and ripple suppression in control modules and electronic subsystems where AEC-Q200 qualification and wide temperature range are required.
• Power Supply Modules – Bulk capacitance and ripple handling for isolated converters, DC–DC regulators, and point-of-load decoupling in compact power designs.
• High-Density PCB Assemblies – Chip-type SMD package suited to space-constrained boards requiring automated placement and high assembly throughput.
• Embedded Systems – Energy storage and filtering in industrial and commercial embedded electronics operating across a wide temperature range.

Unique Advantages

• Low-impedance design – Measured tanδ of 0.1 at 20°C, 120 Hz supports lower loss and improved filtering performance on power rails.
• Dual-frequency ripple capability – Specified ripple currents at both 120 Hz and 10 kHz provide predictable performance across mains and switching frequencies.
• Automated-assembly ready – Supplied in embossed carrier tape and compatible with automatic mounting machines for high-volume, repeatable placement.
• High-temperature endurance – Rated for 2000 hours at 105°C, enabling sustained operation in elevated-temperature environments.
• Automotive-capable – AEC-Q200 rating supports use in designs that require automotive-level qualification.
• Environmental compliance – RoHS compliant to meet regulatory requirements.

Why Choose UCD1H100MCL6GS?

The UCD1H100MCL6GS combines a chip-type, low-impedance architecture with a 50 V, 100 µF electrical profile and an SMD form factor tailored for high-density, automated assembly. Its specification mix—low tanδ, defined ripple currents at multiple frequencies, low leakage, a wide -55°C to 105°C operating range, and 2000 hour endurance at 105°C—makes it well suited to engineers designing robust power delivery and filtering solutions for automotive and industrial-grade applications.

As part of Nichicon’s UCD series and offered in mass-production status, this capacitor delivers a balance of compact size, predictable electrical behavior, and qualification credentials for demanding designs that require long-term reliability.

Request a quote or contact sales to discuss availability, pricing, and lead times for UCD1H100MCL6GS.