UCD1H010MCL1GS

The UCD1H010MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It provides 1 µF capacitance at a 50 V rating in a compact φ4 × 5.8 mm can optimized for high-density PC boards and automated placement.

Key value propositions include low impedance and loss (Z = 2.7 Ω, tanδ = 0.10 at 50 V, 120 Hz), a wide operating temperature range to +105°C, AEC‑Q200 qualification for demanding environments, and embossed carrier taping for automated assembly and mass production.

Key Features

• Core Electrical: 1 µF capacitance with tolerance ±20% (120 Hz, 20°C), rated for 50 V operation.
• Low Impedance and Loss: Specified impedance of 2.7 Ω and tanδ (DF) of 0.10 measured at 20°C, 120 Hz, 50 V to support low-loss applications.
• Ripple Performance: Low-frequency ripple current 30 mA at 120 Hz and high-frequency ripple current 60 mA at 10 kHz.
• Leakage and Endurance: Leakage current 3 µA (measurement condition: after 2 minutes at rated voltage, 20°C) and endurance of 2000 hours at 105°C.
• Robust Temperature Range: Rated for operation from −55°C to +105°C, suitable for elevated-temperature environments.
• Packaging & Mounting: Chip-type surface-mount radial can (φ4 × 5.8 mm) with embossed carrier taping for automatic mounting; recommended land size L: 4.3 × W: 4.3 mm.
• Quality & Compliance: AEC‑Q200 qualified and RoHS compliant, with mass-production status from Nichicon.

Typical Applications

• Automotive Electronics: AEC‑Q200 qualification and an operating range to +105°C make this capacitor appropriate for automotive electronic modules that require SMD capacitors.
• High-Density Surface-Mount PCBs: Chip-type φ4 × 5.8 mm can and compact land pattern support designs where board space is limited and automated placement is used.
• Automated Assembly Lines: Embossed carrier taping enables compatibility with automated mounting machines and high-volume production workflows.
• Elevated-Temperature Applications: 2000-hour endurance at 105°C provides a measurable reliability margin for systems operating at elevated temperatures.

Unique Advantages

• Low-impedance performance: With a specified impedance of 2.7 Ω and tanδ = 0.10 at 50 V, the part delivers reduced AC loss for applications sensitive to ESR/DF.
• Compact SMD can: φ4 × 5.8 mm chip form factor and small land size allow dense PCB layouts without sacrificing rated voltage or capacitance.
• Automated-production ready: Embossed carrier taping and surface-mount packaging simplify pick-and-place integration for mass production.
• High-temperature endurance: Rated life of 2000 hours at 105°C gives a quantified reliability metric for thermal-stressed designs.
• AEC‑Q200 qualified and RoHS compliant: Meets industry quality and environmental requirements for demanding applications.
• Low leakage current: Leakage specified at 3 µA supports low-standby and precision circuits where leakage limits are important.

Why Choose UCD1H010MCL1GS?

UCD1H010MCL1GS positions itself as a compact, low-impedance SMD aluminum electrolytic capacitor engineered for designs that require reliable performance at up to 50 V and elevated temperatures. Its combination of low loss (tanδ = 0.10), defined impedance, AEC‑Q200 qualification, and embossed carrier taping makes it suitable for engineers specifying capacitors for high-density, automated, and thermally demanding assemblies.

This part is well suited to teams looking for a production-ready SMD capacitor with documented endurance and leakage characteristics, backed by Nichicon manufacturing and RoHS compliance for long-term manufacturability and regulatory alignment.

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