UCD1H101MCL6GS

The UCD1H101MCL6GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use. With 100 µF capacitance at 50 V and a compact φ10 × 7.7 mm package, it is intended for high-density PCB assemblies and automatic placement.

Targeted for applications that require robust temperature performance and automotive-grade qualification, this part combines low loss, measurable ripple-current capability, and AEC-Q200 recognition for use in demanding environments.

Key Features

• Capacitance & Voltage — 100 µF nominal capacitance with a rated voltage of 50 V and a capacitance tolerance of ±20% (−20% to +20%).
• Low Impedance / Low Loss — Impedance of 360 mΩ and tangent of loss angle (tan δ) of 0.10 measured at 20°C, 120 Hz, providing low-loss behavior at typical ripple frequencies.
• Ripple Current Handling — Low-frequency ripple current 165 mA at 120 Hz and high-frequency ripple current 330 mA at 10 kHz, specified for board-level power conditioning.
• Leakage Current — Rated leakage current of 50 µA, measured after rated voltage application conditions.
• Temperature & Endurance — Operating temperature range −55°C to +105°C with a rated endurance of 2000 hours at 105°C.
• Package & Mounting — Chip (radial can) SMD package φ10 × 7.7L designed for surface mounting on high-density PC boards; supplied in embossed carrier taping for automated assembly.
• Qualification & Compliance — AEC-Q200 qualified and RoHS compliant; available in mass production.

Typical Applications

• Automotive electronics — Suited to automotive electronic modules where AEC-Q200 qualification and a wide operating temperature range are required.
• High-density SMD power assemblies — Designed for surface mounting on high-density PCBs and compatible with automatic mounting machines fed by carrier tape.
• Board-level power decoupling — Compact chip form factor and low impedance make it appropriate for PCB-level smoothing and decoupling in power subsystems.

Unique Advantages

• Low impedance and controlled loss: 360 mΩ impedance with tan δ = 0.10 (20°C, 120 Hz) delivers predictable performance for power conditioning tasks.
• Defined ripple capability: Rated for 165 mA at 120 Hz and 330 mA at 10 kHz, enabling specification-driven selection for both low- and high-frequency ripple environments.
• Automotive-grade qualification: AEC-Q200 listing supports use in automotive electronic systems requiring industry-recognized component qualification.
• Wide temperature endurance: Operates from −55°C to +105°C with a 2000-hour endurance rating at 105°C, supporting long-term reliability in elevated-temperature applications.
• SMD-ready packaging: Chip radial can package (φ10 × 7.7L) and embossed carrier taping simplify automated placement and high-density PCB assembly.
• Regulatory compliance and availability: RoHS compliant and in mass production, supporting volume sourcing and regulatory requirements.

Why Choose UCD1H101MCL6GS?

The UCD1H101MCL6GS positions itself as a compact, specification-driven SMD electrolytic solution for designs that require 100 µF at 50 V with measurable low-impedance and ripple-handling capability. Its AEC-Q200 qualification, wide operating temperature range, and specified endurance at 105°C make it a solid choice for automotive and other demanding electronics where board-level power stability and long-term reliability matter.

Engineers and procurement teams benefit from a part that is supplied for automated assembly (embossed carrier taping) and available in mass production, enabling predictable supply-chain integration and streamlined assembly for high-density PCB designs.

Request a quote or contact sales to discuss availability, lead times, and sample options for the UCD1H101MCL6GS.