UCD1H151MNS1GS

The UCD1H151MNS1GS is a chip-type aluminum electrolytic capacitor engineered for surface-mount use on high-density PC boards. Its low-impedance construction, AEC-Q200 qualification, and RoHS compliance make it suitable for demanding environments that require reliable, compact energy storage.

Key attributes include a 150 µF capacitance at 50 V, an operating temperature range from -55 °C to +105 °C, and endurance ratings optimized for elevated-temperature operation.

Key Features

• Electrical — 150 µF rated capacitance with a 50 V rated voltage and polarization; capacitance tolerance is ±20% (120 Hz, 20 °C).
• Low Impedance Design — Chip-type, low-impedance construction for improved AC performance and effective ripple handling at both low and high frequencies.
• Ripple Current Capability — Specified ripple currents of 350 mA at 120 Hz and 700 mA at 10 kHz to support dynamic load conditions.
• Thermal and Endurance — Operating range from -55 °C to +105 °C and rated lifetime of 5000 hours at 105 °C.
• Reliability — AEC-Q200 qualified and meets leakage current limits (after 2 minutes at rated voltage, ≤0.01 CV or 3 µA, whichever is greater).
• Package and Assembly — Radial can SMD (chip type) designed for surface mounting on high-density PCBs and compatible with automatic mounting machines fed with carrier tape. Physical footprint: 10 mm × 10 mm with recommended land size 10.3 mm × 10.3 mm.
• Environmental Compliance — Compliant to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and a wide temperature range make this capacitor suitable for automotive modules requiring durable, long-life capacitors.
• High-Density PCBs — Chip-type SMD package and compact 10 mm × 10 mm footprint enable use in space-constrained board designs.
• Automatic Assembly Environments — Designed for compatibility with carrier-tape fed automatic mounting machines to streamline production.

Unique Advantages

• Durable High‑Temperature Endurance: 5000 hours at 105 °C provides predictable performance in elevated-temperature applications.
• AEC‑Q200 Qualified: Qualification supports deployment in automotive-grade designs where component-level reliability matters.
• Low-Impedance Performance: Chip-type construction reduces impedance for improved transient and ripple handling across frequency ranges.
• Assembly-Ready SMD Package: Radial can SMD form factor and carrier-tape compatibility reduce PCB routing constraints and speed automated assembly.
• Compact Footprint: 10 mm × 10 mm size and small recommended land pattern save board space for high-density designs.
• Measured Ripple Ratings: Explicit ripple current specifications at 120 Hz and 10 kHz enable accurate thermal and reliability planning.

Why Choose UCD1H151MNS1GS?

The UCD1H151MNS1GS combines a compact chip‑type SMD package with low impedance characteristics, defined ripple current performance, and high-temperature endurance to meet the needs of demanding electronic assemblies. Its AEC-Q200 qualification and RoHS compliance position it for long-term use in regulated and high-reliability applications.

This part is well suited to designers and procurement teams building compact, assembly-friendly power and electronic modules that require verified thermal endurance, predictable leakage behavior, and automated-production compatibility.

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