UCD1H221MNS1GS
| Part Description |
220 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,069 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 220 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.1 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 5000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 700 mA @ 10 kHz | Ripple Current Low Frequency | 350 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 10 x 10 mm | Surface Mount Land Size | 10.3 x 10.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UCD1H221MNS1GS – Chip-Type Low-Impedance Aluminum Electrolytic Capacitor, 220 µF, 50 V
The UCD1H221MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly on high-density PCBs. It delivers 220 µF at 50 V in a compact φ10×10L SMD package and is compatible with automatic mounting from carrier tape.
Engineered for demanding environments, this part supports an operating temperature range of -55°C to 105°C, AEC-Q200 qualification, and RoHS compliance, making it suitable for applications that require sustained ripple handling, thermal endurance, and automated production.
Key Features
- Capacitance and Voltage — 220 µF rated capacitance with a rated voltage of 50 V and capacitance tolerance of -20% to +20% (measured at 120 Hz, 20°C).
- Low Loss / Low Impedance — tanδ (D.F.) 0.1 measured at 120 Hz and 20°C for the 50 V rating, supporting low-loss performance in decoupling and smoothing roles.
- Ripple Current Capability — Specified low-frequency ripple current of 350 mA at 120 Hz and high-frequency ripple current of 700 mA at 10 kHz to address dynamic load conditions.
- Leakage Current — Leakage current of 110 µA after standard application of rated voltage.
- High Temperature Endurance — Rated for 5000 hours at 105°C under rated voltage, with category temperature range from -55°C to 105°C.
- Automotive-Grade Reliability — AEC-Q200 qualification and vibration resistance for use in demanding automotive and industrial environments.
- Surface-Mount, Tape-Ready Package — Chip-type SMD (radial, can - SMD) in size φ10×10L with embossed carrier taping for automatic placement.
- Regulatory Compliance — RoHS compliant.
Typical Applications
- Automotive Electronics — AEC-Q200 qualification and vibration resistance make this capacitor suitable for automotive power systems and electronic modules.
- High-density PCB Assemblies — Chip-type SMD and embossed carrier taping support automatic mounting on densely populated circuit boards.
- Power Supply Filtering — 220 µF capacitance with defined ripple current ratings supports smoothing and decoupling on regulated power rails.
Unique Advantages
- Compact high-capacitance SMD — 220 µF in a φ10×10L chip package reduces board space while delivering usable capacitance for power circuits.
- Designed for automated production — Embossed carrier taping and surface-mount form factor streamline pick-and-place assembly.
- Thermal and long-term endurance — 5000-hour rating at 105°C ensures sustained performance in elevated-temperature environments.
- Defined ripple handling — Separate low- and high-frequency ripple current specifications (350 mA @120 Hz, 700 mA @10 kHz) allow designers to match the component to dynamic load conditions.
- Automotive-capable — AEC-Q200 qualification and vibration resistance support deployment in automotive-grade designs.
- Regulatory conformity — RoHS compliant for environmental and manufacturing requirements.
Why Choose UCD1H221MNS1GS?
The UCD1H221MNS1GS balances high capacitance and low impedance in a compact, surface-mount chip package intended for automated assembly and long-term thermal endurance. Its defined ripple current ratings, low loss (tanδ 0.1 @ 120 Hz), and AEC-Q200 qualification position it for reliable service in automotive and other demanding electronic systems.
This part is suited for designers seeking a space-efficient electrolytic solution that integrates with high-density PCBs, supports elevated-temperature operation, and meets automotive reliability expectations while remaining RoHS compliant.
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Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016