UCD1H330MCS1GS
| Part Description |
33 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,459 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 8.7 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 195 mA @ 10 kHz | Ripple Current Low Frequency | 97.5 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 7.7 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UCD1H330MCS1GS – Chip Type Aluminum Electrolytic Capacitor, 33 µF / 50 V, SMD
The UCD1H330MCS1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor engineered for surface mounting on high‑density printed circuit boards. It combines a 33 µF capacitance with a 50 V rating and a compact radial can SMD package for space‑constrained designs.
Designed for automated assembly and high reliability, this part is RoHS compliant and AEC‑Q200 qualified, with an operating temperature range from −55 °C to +105 °C and defined endurance at elevated temperature for automotive and industrial applications.
Key Features
- Capacitance & Voltage — 33 µF rated capacitance at 50 V with tolerance ±20% (measured at 120 Hz, 20 °C).
- Low Impedance Performance — Low impedance chip type with specified tan δ (max. 0.10 at 50 V, 120 Hz, 20 °C) and measured ripple current ratings of 97.5 mA at 120 Hz and 195 mA at 10 kHz.
- Wide Temperature Range — Operates from −55 °C to +105 °C, with specified impedance ratios for low‑temperature stability (Z(−25 °C)/Z(+20 °C)=2, Z(−40 °C)/Z(+20 °C)=3, Z(−55 °C)/Z(+20 °C)=3).
- Automotive Qualification & Environmental Compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), suitable for regulated manufacturing environments.
- Surface‑Mount Packaging — Radial, can‑style SMD package sized L: 7.7 × D: 6.3 mm with recommended PCB land size L: 6.6 × W: 6.6 mm; compatible with automatic mounting machines fed by carrier tape.
- Endurance & Reliability — Rated endurance of 2000 hours at 105 °C (for the rated voltage and size class), leakage current specification of ≤0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C, and soldering heat resistance (250 °C hot plate, 30 s) with capacitance change within ±10% after reflow test.
Typical Applications
- Automotive electronics — Suitable for electronic control modules and in‑vehicle systems requiring AEC‑Q200 qualification and extended temperature operation.
- High‑density surface‑mount PCBs — Compact chip‑type can enables decoupling and energy storage in space‑constrained board layouts.
- Automated assembly and volume production — Designed for compatibility with carrier‑tape feed and automatic mounting equipment for efficient mass production.
Unique Advantages
- Automotive‑grade reliability: AEC‑Q200 qualification supports use in regulated automotive electronics and designs requiring defined component qualification.
- High temperature capability: Rated to +105 °C with specified endurance (2000 hours at 105 °C) for applications exposed to elevated operating temperatures.
- Verified low‑loss characteristics: Low tan δ at 50 V (max. 0.10 at 120 Hz) and defined ripple current ratings for stable performance under AC conditions.
- SMD form factor for dense designs: Small radial can SMD package and defined PCB land pattern simplify integration on high‑density boards.
- Manufacturing friendly: Compatible with carrier‑tape automatic mounting and resistant to soldering heat (250 °C, 30 s), easing assembly and reflow processes.
- Defined electrical limits: Clear leakage current and endurance specifications (≤0.01 CV or 3 µA after 2 minutes; capacitance change within ±30% after endurance test) assist in design verification and qualification.
Why Choose UCD1H330MCS1GS?
The UCD1H330MCS1GS delivers a compact, automotive‑qualified SMD electrolytic capacitor option where low impedance, elevated temperature tolerance, and automated assembly compatibility are required. Its combination of 33 µF/50 V electrical performance, specified ripple currents, and endurance data make it suitable for designers targeting robust, space‑efficient power and decoupling solutions.
Engineers and procurement teams seeking a thoroughly specified capacitor for high‑density PCBs and automotive electronics will find clear performance metrics and manufacturing compatibility to support reliable integration and qualification in production programs.
Request a quote or contact sales to discuss pricing, lead times, and availability for part number UCD1H330MCS1GS.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016