UCD1H331MNJ1MS

The UCD1H331MNJ1MS is a chip-type aluminum electrolytic capacitor engineered for surface-mount, high-density PC board applications. It provides low impedance performance across a wide temperature range and is designed for automated assembly lines.

With a capacitance of 330 µF at a 50 V rating, AEC-Q200 qualification, RoHS compliance, and an operating range from -55 °C to 105 °C, this capacitor targets automotive and other demanding electronics that require reliable, high-temperature SMD capacitors with long endurance.

Key Features

• Capacitance & Voltage — 330 µF rated capacitance at 50 V, with a tolerance of ±20% (measured at 120 Hz, 20 °C).
• Chip-Style, Low Impedance — Chip-type construction offering low impedance characteristics for improved AC performance at 120 Hz and higher frequencies.
• High Temperature Operation — Specified operating temperature range of -55 °C to +105 °C, enabling use in elevated-temperature environments.
• Endurance — Rated for 5000 hours at 105 °C, supporting long-term stability under high-temperature stress conditions.
• High Ripple Current Capability — Ripple current ratings of 450 mA at 120 Hz and 900 mA at 10 kHz to support AC load conditions.
• Automated Assembly Compatible — Designed for surface mounting on high-density PCBs and suitable for automatic mounting machines fed with carrier tape.
• Package & Footprint — Radial can, SMD package with overall dimensions L × D: 1.35 × 1.25 cm and recommended land size L × W: 1.28 × 1.28 cm for board layout.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863); leakage current after 2 minutes ≤ 0.01 CV or 3 µA (whichever is greater).
• Low-Temperature Stability — Impedance stability characterized down to -55 °C (measurement at 120 Hz), with impedance ratios specified relative to +20 °C.

Typical Applications

• Automotive systems — AEC-Q200 qualification and high-temperature endurance make this part suitable for automotive electronic modules.
• High-density SMD assemblies — Chip-style construction and defined land size support surface mounting on compact, densely populated PCBs.
• Automated manufacturing — Designed for compatibility with carrier-tape fed automatic mounting machines to streamline assembly processes.

Unique Advantages

• High-temperature endurance: 5000 hours at 105 °C provides verified longevity for prolonged high-temperature operation.
• AEC-Q200 qualification: Explicit reliability qualification for automotive-grade applications where standardized qualification is required.
• Low impedance across frequencies: Ripple current ratings (450 mA at 120 Hz, 900 mA at 10 kHz) indicate robust AC handling for power circuits.
• Assembly-ready design: Chip form factor and carrier-tape compatibility reduce assembly complexity on automated production lines.
• Compact SMD package: Small L × D footprint (1.35 × 1.25 cm) and defined land size simplify PCB layout for space-constrained designs.
• Regulatory compliance: RoHS conformity supports deployment in regulated product lines.

Why Choose UCD1H331MNJ1MS?

The UCD1H331MNJ1MS balances compact, chip-style SMD packaging with performance-focused specifications—330 µF at 50 V, low impedance behavior, and defined ripple current capability—making it a strong option for designs that require reliable bulk capacitance in a surface-mount form. Its AEC-Q200 qualification, RoHS compliance, and 5000-hour endurance at 105 °C position it for long-term use in automotive and other high-reliability applications.

This part is suited to engineers and procurement teams working on compact, high-density PCBs that require components compatible with automated assembly and sustained operation at elevated temperatures. The combination of specified electrical performance and assembly-ready packaging helps reduce integration risk and supports robust product lifecycles.

Request a quote or contact sales to discuss availability, pricing, and application-specific support for the UCD1H331MNJ1MS.