UCD1H331MNQ1MS

The UCD1H331MNQ1MS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density printed circuit boards. It delivers 330 µF at 50 V in a compact SMD can package with an extended operating temperature range up to +105°C.

Targeted for demanding electronics, this device is AEC‑Q200 qualified and RoHS compliant, and is suitable for automated assembly using carrier tape feeding for high‑volume production.

Key Features

• Capacitance & Voltage — 330 µF rated capacitance at 50 V provides substantial bulk energy storage in a single SMD component.
• Low Impedance Performance — Chip‑type construction optimized for low impedance across temperature and frequency, with series ripple current ratings of 450 mA at 120 Hz and 900 mA at 10 kHz.
• Wide Temperature Range — Rated for operation from −55 °C to +105 °C for applications requiring extended temperature capability.
• Long Life Endurance — Specified lifetime of 5000 hours at 105 °C under rated voltage conditions, supporting long‑term reliability in high‑temperature environments.
• SMD Can Package — Radial, can‑style SMD package with compact dimensions (L: 1.35 × D: 1.25 cm) and defined land pattern (1.28 × 1.28 cm) for dense PCB layouts.
• Assembly Ready — Designed for surface mounting on high‑density PC boards and compatible with automatic mounting machines fed with carrier tape.
• Quality & Compliance — AEC‑Q200 qualified and compliant with the RoHS directive (2011/65/EU, (EU)2015/863).
• Polarized Electrolytic — Polarized capacitor with tolerance of −20% to +20% suitable for DC filtering and bulk decoupling where polarity is maintained.

Typical Applications

• Automotive Electronic Modules — AEC‑Q200 qualification and high‑temperature rating make the UCD1H331MNQ1MS suitable for automotive control units and electronic modules on high‑density SMD boards.
• Power Supply Smoothing — 330 µF/50 V capacitance and low impedance support bulk energy storage and smoothing in compact SMD power stages.
• High‑Density PCB Designs — Chip‑type SMD can package and defined land pattern enable placement on space‑constrained, automated assembly lines.

Unique Advantages

• High‑temperature endurance: Rated for operation up to +105 °C with a 5000‑hour lifetime at that temperature, improving reliability in thermal‑stress environments.
• Robust ripple handling: Specified ripple current ratings at both low and high frequencies (450 mA at 120 Hz, 900 mA at 10 kHz) for dependable performance in switching power applications.
• Automated assembly compatibility: Designed for carrier‑tape feed and surface mounting, simplifying high‑volume PCB assembly.
• Automotive‑grade qualification: AEC‑Q200 qualification supports use in automotive systems requiring component level reliability traceability.
• Compact SMD can footprint: Small package dimensions and matched land pattern enable dense board layouts without sacrificing capacitance.
• Regulatory compliance: RoHS compliance reduces environmental and regulatory risk in product designs.

Why Choose UCD1H331MNQ1MS?

The UCD1H331MNQ1MS positions itself as a reliable, high‑temperature SMD electrolytic capacitor option for engineers building compact, high‑density electronic modules—particularly where automotive qualification and extended temperature endurance are required. Its combination of 330 µF capacitance at 50 V, low impedance characteristics, defined SMD package, and AEC‑Q200 qualification make it a straightforward choice for demanding power delivery and smoothing applications.

For designs that need durability under thermal stress, compatibility with automated assembly, and clear regulatory compliance, this capacitor offers a balance of performance and practical board‑level integration.

If you would like pricing, availability, or a formal quote for UCD1H331MNQ1MS, submit a quote request or contact sales to arrange a parts inquiry and technical support.