UCD1H331MNS1MS

The UCD1H331MNS1MS is a surface-mount aluminum electrolytic capacitor in Nichicon’s UCD series, engineered as a low-impedance chip-type solution for high-density PCB assemblies. It delivers 330 µF capacitance at a 50 V rating and is optimized for applications demanding wide temperature range and long-duration endurance.

Designed for automotive use and AEC-Q200 qualification, this part offers robust electrical performance, vibration resistance, and carrier-tape packaging for automatic placement—making it suitable for demanding electronics where reliability and compact SMD form factor are required.

Key Features

• Core Electrical Performance — 330 µF nominal capacitance with a tolerance of -20% to +20% and a rated voltage of 50 V, providing bulk energy storage for power rails and decoupling.
• Low Loss Characteristics — tan δ (DF) of 0.10 measured at 20°C, 120 Hz, supporting applications where low dissipation factor is required.
• Ripple Current Capability — Low-frequency ripple current of 450 mA (120 Hz) and high-frequency ripple current of 900 mA (10 kHz) to handle both mains-frequency and switching regulator ripple.
• Leakage Current — Specified leakage current of 165 µA, suitable for power-sensitive circuits where controlled leakage is important.
• High Temperature Endurance — Rated lifetime of 5000 hours at 105°C, providing predictable long-term performance in elevated-temperature environments.
• Wide Operating Range — Operating temperature from -55°C to +105°C for extended environmental tolerance.
• Compact SMD Package — Chip-type radial can SMD in a φ12.5 × 13.5 mm package (L: 1.35 × D: 1.25 cm), designed for surface mounting and high-density board layouts.
• Placement & Handling — Supplied in embossed carrier taping for compatibility with automatic pick-and-place equipment.
• Reliability & Robustness — Vibration resistant construction and AEC-Q200 rating to support demanding, regulated applications.
• Compliance — RoHS compliant.

Typical Applications

• Automotive Electronics: Energy storage and decoupling on automotive PCBs where AEC-Q200 qualification and wide temperature endurance are required.
• Power Management Modules: Bulk capacitance for DC–DC converters and power rails that must tolerate both low- and high-frequency ripple currents.
• Infotainment & Telematics: SMD form factor and embossed taping enable automated assembly of compact modules used in infotainment and telematics systems.
• Industrial Control Electronics: Durable high-temperature performance and vibration resistance for embedded controllers and power electronics in industrial environments.

Unique Advantages

• Automotive-Ready Qualification: AEC-Q200 rating aligns the part with automotive development and qualification requirements.
• Long High-Temperature Life: 5000 hours endurance at 105°C provides predictable aging and service life in elevated-temperature installations.
• Dual-Frequency Ripple Handling: Specified ripple current at both 120 Hz and 10 kHz supports synchronous buck converters and legacy power systems alike.
• Compact, Automated Assembly Friendly: Chip-type SMD package with embossed carrier taping enables efficient, high-density PCB assembly and automated placement.
• Vibration Resistance: Mechanical robustness suited to environments with mechanical shock and vibration.
• Controlled Loss and Leakage: Low tan δ and defined leakage current help maintain efficiency and predictable behavior in power-sensitive designs.

Why Choose UCD1H331MNS1MS?

The UCD1H331MNS1MS combines a compact surface-mount chip form factor with verified electrical and environmental performance: 330 µF at 50 V, low dissipation, and rated endurance at 105°C. Its AEC-Q200 qualification and vibration-resistant construction position it for use in automotive and other demanding applications where reliability, thermal endurance, and automated assembly compatibility are priorities.

This capacitor is well suited for engineers designing power rails, DC–DC converters, infotainment modules, and industrial control electronics that require a balance of capacitance density, ripple handling, and long-term stability under elevated temperatures.

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