UCD1H3R3MCL1GS

The UCD1H3R3MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon designed for surface-mount applications. It provides 3.3 µF capacitance at a 50 V rating in a compact φ4 × 5.8 mm SMD can, and is supplied in embossed carrier tape for automatic mounting.

Engineered for high-temperature operation up to 105°C and AEC-Q200 qualification, this part is suited to high-density PCB assemblies and applications that require stable performance, controlled leakage (≤3 µA), and defined ripple current capability.

Key Features

• Electrical Performance: 3.3 µF nominal capacitance with tolerance of −20% to +20% and specified impedance of 2.7 Ω.
• Rated Voltage: 50 V working voltage suited to mid-voltage board-level applications.
• Low Loss / Dissipation: tanδ (DF) of 0.10 measured at 20°C, 120 Hz for the 50 V rating, supporting stable AC performance.
• Ripple Current Capability: Low-frequency ripple current 30 mA at 120 Hz and high-frequency ripple current 60 mA at 10 kHz.
• Leakage Current: Leakage current specified at 3 µA (whichever is greater per datasheet conditions), enabling predictable standby loss.
• Temperature Range & Endurance: Operating range −55°C to +105°C with endurance rated at 2000 hours at 105°C for the specified size and voltage.
• Package & Mounting: φ4 × 5.8 mm SMD radial can (chip type), surface-mountable with embossed carrier taping compatible with automatic mounting machines; recommended land size L:4.3 × W:4.3 mm.
• Quality & Compliance: AEC-Q200 qualified and RoHS compliant; part is in mass production.

Typical Applications

• Automotive Electronics: Applicable to automotive electronic modules where AEC-Q200 qualification and high-temperature endurance are required.
• High-Density Surface-Mount PCBs: Designed for surface mounting on high-density boards and compatible with automatic carrier-tape mounting.
• Temperature-Intensive Assemblies: Use in assemblies demanding stable performance up to +105°C and defined endurance at elevated temperatures.

Unique Advantages

• Compact SMD Form Factor: φ4 × 5.8 mm chip-type can minimizes board space while delivering 3.3 µF capacitance.
• Low-Impedance Performance: Specified impedance of 2.7 Ω and low loss (tanδ 0.10) support reliable AC behavior in filtered and decoupled circuits.
• Defined Ripple Handling: Separate low- and high-frequency ripple current ratings (30 mA @120 Hz, 60 mA @10 kHz) allow predictable thermal and performance planning.
• High-Temperature Endurance: Rated for operation to 105°C with 2000 hours endurance at that temperature, providing design margin for demanding environments.
• Assembly-Ready Packaging: Supplied in embossed carrier taping for automatic placement, simplifying high-volume assembly flows.
• Qualified and Compliant: AEC-Q200 qualification and RoHS compliance provide traceable quality and regulatory alignment.

Why Choose UCD1H3R3MCL1GS?

UCD1H3R3MCL1GS combines a compact chip-type SMD package with low-impedance electrical characteristics and defined ripple/ leakage behavior, making it appropriate for designs that require predictable AC performance and controlled losses. Its 50 V rating, −55°C to +105°C operating range, and 2000-hour endurance at 105°C address thermal and reliability demands in challenging environments.

Backed by Nichicon and available in embossed carrier tape for automatic mounting, this part is well suited to engineers and procurement teams targeting reliable, production-ready components for automotive and high-density surface-mount assemblies.

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