UCD1H470MCL6GS

The UCD1H470MCL6GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. With a 47 µF capacitance at 50 V and an operating temperature range from -55 °C to +105 °C, it targets applications requiring compact, robust power components.

Built for automated production, this SMD radial can is compatible with carrier‑tape placement and is AEC‑Q200 qualified and RoHS compliant, making it suited for demanding electronics including automotive systems.

Key Features

• Capacitance & Voltage — 47 µF rated capacitance at 50 V provides energy storage suitable for board‑level power applications.
• Low Impedance — Specified impedance of 630 mΩ for improved AC performance in compact packages.
• Temperature & Endurance — Rated for -55 °C to +105 °C operation with a guaranteed lifetime of 2000 hours at 105 °C.
• Ripple Current Capability — 100 mA at 120 Hz and 200 mA at 10 kHz to handle AC ripple on power rails.
• Mounting & Package — Chip‑type radial can in an SMD package, designed for surface mounting on high‑density PC boards; surface‑mount land pattern 8.3 × 8.3 mm.
• Automated Assembly Ready — Applicable to automatic mounting machines fed with carrier tape for efficient pick‑and‑place production.
• Quality & Compliance — AEC‑Q200 qualified and RoHS compliant to support regulated and reliability‑sensitive designs.
• Tolerance & Polarity — Capacitance tolerance ±20% and polarized construction (Polar).

Typical Applications

• Automotive electronics — Suitable for surface‑mount modules in automotive systems where AEC‑Q200 qualification and high‑temperature endurance are required.
• High‑density power assemblies — Fits compact PCBs that demand low‑impedance capacitors for board‑level energy storage and ripple management.
• Automated production environments — Designed for carrier‑tape fed placement, streamlining high‑volume assembly of surface‑mount designs.

Unique Advantages

• High‑temperature capability: Operation to +105 °C with 2000 hours specified lifetime at 105 °C supports thermally demanding applications.
• AEC‑Q200 qualification: Provides an established reliability baseline for automotive and similarly demanding markets.
• Low impedance: 630 mΩ impedance improves AC performance in compact SMD form factors, aiding ripple handling and stability on power rails.
• Assembly efficiency: Carrier‑tape compatible chip package enables automated pick‑and‑place manufacturing for higher throughput.
• Regulatory compliance: RoHS compliance simplifies regulatory management for global production.
• Compact SMD can: Small footprint (L: 6.2 × D: 8 mm) with defined land pattern (8.3 × 8.3 mm) for dense PCB layouts.

Why Choose UCD1H470MCL6GS?

The UCD1H470MCL6GS combines low impedance, high temperature endurance and AEC‑Q200 qualification in a compact SMD radial can, making it an effective choice for designs that require reliable board‑level energy storage in constrained spaces. Its carrier‑tape compatibility and surface‑mount form factor support automated assembly and high‑density PCB integration.

This capacitor is well suited to engineers and procurement teams specifying components for automotive and other reliability‑focused electronics where documented endurance at elevated temperature, RoHS compliance, and predictable ripple handling are priorities.

Request a quote or contact sales to check availability, lead times and pricing for UCD1H470MCL6GS.