UCD1H471MNJ1MS

The UCD1H471MNJ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use. It provides 470 µF capacitance at a 50 V rating in a compact φ16 × 16.5 mm can-style SMD package and is supplied on embossed carrier tape for automated assembly.

Engineered for demanding environments, this part supports operation from −55 °C to +105 °C and carries AEC-Q200 qualification. Typical use cases include automotive and other high-reliability electronics where long endurance, high ripple handling and compact surface-mount packaging are required.

Key Features

• Capacitance & Voltage — 470 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance.
• Low Impedance Performance — Chip-type low-impedance construction with specified tan δ of 0.10 (measured at 20 °C, 120 Hz) for stable AC performance.
• Ripple Current Handling — Specified low-frequency ripple current of 805 mA at 120 Hz and high-frequency ripple current of 1.61 A at 10 kHz to support power filtering and decoupling.
• Leakage Current — Leakage current specified at 235 µA, appropriate for power-management applications requiring controlled leakage.
• High-Temperature Endurance — Rated for operation from −55 °C to +105 °C with a lifetime/endurance of 5000 hours at 105 °C.
• Surface-Mount Packaging — Radial can SMD package (φ16 × 16.5L) with embossed carrier taping suitable for automatic placement.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant for use in regulated production environments.

Typical Applications

• Automotive electronic modules — Designed and qualified (AEC-Q200) for use in automotive systems that require surface-mount power capacitors.
• Power supply filtering — Low-impedance, high-capacitance SMD solution for smoothing and ripple control on high-density PCBs.
• High-temperature electronics — Suitable for assemblies operating up to 105 °C with a specified 5000-hour endurance at that temperature.
• Automated SMD assembly — Supplied in embossed carrier tape for compatibility with automatic placement equipment on high-density boards.

Unique Advantages

• High capacitance in an SMD chip — 470 µF packaged in a φ16 × 16.5 mm SMD can gives designers substantial bulk capacitance without through-hole assembly.
• Designed for ripple and transient stresses — Specified ripple current ratings at both low and high frequencies (805 mA at 120 Hz, 1.61 A at 10 kHz) help manage supply ripple and switching transients.
• Long high-temperature life — 5000 hours endurance at 105 °C provides predictable performance for elevated-temperature applications.
• AEC-Q200 qualification — Supports use in automotive-grade designs where applicable qualification is required.
• Assembly-friendly packaging — Embossed carrier taping enables rapid integration into automated surface-mount production lines.
• Regulatory compliance — RoHS compliant to meet common environmental and regulatory requirements.

Why Choose UCD1H471MNJ1MS?

The UCD1H471MNJ1MS combines a high 470 µF capacitance and 50 V rating with low-impedance performance in a compact, surface-mount chip package. Its specified ripple current capabilities, controlled leakage, and tan δ behavior make it suitable for power filtering and decoupling in high-density assemblies.

With AEC-Q200 qualification, RoHS compliance, embossed carrier taping for automated placement, and a 5000-hour endurance at 105 °C, this capacitor is positioned for engineers designing robust, long-lived systems in automotive and other demanding markets seeking reliable SMD bulk capacitance.

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