UCD1H470MCS1GS

The UCD1H470MCS1GS is a chip-type, low-impedance aluminum electrolytic capacitor engineered for surface-mount, high-density PCB assemblies. It delivers 47 µF capacitance at a 50 V rating in a compact φ6.3 × 7.7 mm can suitable for automated placement from embossed carrier tape.

Designed for demanding thermal and mechanical environments, this part supports an operating temperature range of -55 °C to 105 °C, AEC-Q200 qualification, and features vibration resistance—targeting automotive electronics and other applications that require reliable power smoothing and decoupling in compact SMD formats.

Key Features

• Core Electricals  47 µF capacitance with tolerance -20% to +20% and a rated voltage of 50 V, providing stable capacitance for board-level power management.
• Low Loss / Low Impedance  Tangent of loss angle (tan δ) of 0.10 measured at 20 °C, 120 Hz, indicating low dissipation for improved ripple handling.
• Ripple Current Capability  Low-frequency ripple current 97.5 mA (120 Hz) and high-frequency ripple current 195 mA (10 kHz), supporting AC ripple and switching noise suppression.
• Leakage Current  Specified leakage current of 23.5 µA, suitable for power applications where controlled leakage is required.
• Temperature & Endurance  Operating range -55 °C to 105 °C with a rated endurance of 2000 hours at 105 °C for the part’s size class (φ6.3 × 7.7 mm).
• Qualification & Reliability  AEC-Q200 qualification and vibration resistance enhance suitability for automotive and other mechanically demanding environments.
• Package & Assembly  Chip-type radial can SMD (φ6.3 × 7.7 mm) with embossed carrier taping for automatic placement; surface-mount land size L: 6.6 × W: 6.6 mm.
• Environmental Compliance  RoHS compliant construction for regulatory alignment.

Typical Applications

• Automotive electronics  AEC-Q200 qualification and high-temperature endurance make this capacitor suitable for power filtering and decoupling in automotive control modules and electronic subsystems.
• On-board power regulation  Compact SMD package and low impedance support smoothing and decoupling on DC-DC converters and local power rails.
• High-density PCB assemblies  Chip-type can and embossed carrier tape packaging enable automated placement in tightly packed boards where space and assembly throughput matter.

Unique Advantages

• Compact, assembly-ready format  Chip-type can in embossed carrier tape simplifies automated SMD assembly and conserves board space.
• Low-impedance performance  Measured tan δ of 0.10 and specified ripple currents support effective suppression of switching noise and ripple on power rails.
• High-temperature endurance  Rated for operation up to 105 °C with a 2000-hour endurance rating at that temperature for the size class, supporting extended reliability in hot environments.
• AEC-Q200 qualified  Qualification provides an added level of process and reliability assurance for automotive and similarly demanding applications.
• Vibration resistant  Mechanical robustness for applications exposed to vibration and shock.
• Regulatory compliance  RoHS compliance supports environmentally constrained designs.

Why Choose UCD1H470MCS1GS?

The UCD1H470MCS1GS balances compact SMD packaging with performance-oriented electrical characteristics—47 µF at 50 V, low tan δ, and defined ripple current ratings—making it well suited for board-level power smoothing in automotive-grade and high-density electronics. Its AEC-Q200 qualification, vibration resistance, and 105 °C endurance profile position it for applications that require stable capacitance and mechanical reliability over time.

This part is ideal for designers and procurement teams specifying capacitors for automotive modules, on-board DC-DC converters, and compact high-density PCBs where automated assembly, thermal endurance, and verified qualification are key considerations.

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