UCD1H2R2MCL1GS

The UCD1H2R2MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon's UCD series, optimized for surface-mount use on high-density PCBs. It delivers 2.2 µF capacitance at a 50 V rating in a compact SMD radial can package.

Designed for automated assembly and mass production, this part targets automotive and industrial electronics where a small-footprint, high-temperature-capable, and AEC-Q200-qualified SMD capacitor is required for power filtering and decoupling applications.

Key Features

• Capacitance & Voltage — 2.2 µF nominal capacitance with tolerance -20% to +20%, rated for 50 V operation.
• Chip-type, low impedance — Designed as a chip-type low-impedance SMD capacitor for improved AC performance on power rails.
• Loss tangent (tan δ) — tanδ = 0.1 measured at 20°C, 120 Hz for the 50 V rating, supporting stable AC behavior.
• Ripple current capability — Specified ripple handling of 30 mA at 120 Hz (low frequency) and 60 mA at 10 kHz (high frequency) to support filtering across a range of frequencies.
• Low leakage — Leakage current specified at 3 µA, minimizing standby current draw.
• Temperature range & endurance — Operating range -55°C to +105°C with rated endurance of 2000 hours at 105°C.
• AEC-Q200 qualified — Meets AEC-Q200 qualification as indicated in the product specifications for automotive-grade design use.
• Package & assembly — Compact φ4 × 5.8 mm can (SMD radial), surface-mount land size 4.3 × 4.3 mm, supplied in embossed carrier taping for automated placement and mass production.
• RoHS compliant — Conforms to applicable RoHS directives.

Typical Applications

• Automotive electronics — Power decoupling and filtering in automotive modules where AEC-Q200 qualification and extended temperature range are required.
• High-density power management — Local rail decoupling and smoothing on compact, densely populated PCBs benefitting from a small SMD can footprint.
• Automated assembly environments — Supplied in embossed carrier taping and sized for compatibility with automatic mounting machines in high-volume production.

Unique Advantages

• Compact SMD form factor: φ4 × 5.8 mm package minimizes board area while retaining aluminum electrolytic capacitance.
• Automotive-grade qualification: AEC-Q200 rating supports use in automotive system designs that require component-level qualification.
• Broad temperature endurance: Rated for -55°C to +105°C with 2000 hours endurance at 105°C, supporting long-term operation in elevated-temperature environments.
• Low loss and low leakage: tanδ = 0.1 and leakage current of 3 µA help reduce AC losses and standby current.
• Dual-frequency ripple handling: Specified ripple current at both 120 Hz and 10 kHz supports filtering across low- and high-frequency domains.
• Assembly-ready packaging: Embossed carrier taping and SMD can style streamline automated placement and high-volume manufacturing.

Why Choose UCD1H2R2MCL1GS?

The UCD1H2R2MCL1GS combines a compact chip-type SMD package with specifications tailored for reliable power filtering and decoupling in temperature-challenging and automotive applications. With AEC-Q200 qualification, low loss, low leakage, and specified ripple performance at multiple frequencies, it addresses common needs for board-level power stability in dense assemblies.

Ideal for engineers and procurement teams specifying SMD aluminum electrolytic capacitors for automotive and industrial designs, this Nichicon UCD-series part offers a balance of small footprint, durability, and assembly-friendly packaging for scalable production runs.

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