UCD1H221MNL1GS

The UCD1H221MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It provides 220 µF capacitance at a 50 V rating in a compact φ10 × 10 mm can suitable for automated assembly with embossed carrier taping.

Engineered for reliability in demanding environments, the device offers a wide operating temperature range from −55 °C to 105 °C, long endurance (5,000 hours at 105 °C), AEC‑Q200 qualification, and RoHS compliance—making it appropriate for applications where endurance, ripple handling, and board‑level density are priorities.

Key Features

• Core Type Chip‑type, low‑impedance aluminum electrolytic design optimized for surface‑mount use on high‑density PCBs.
• Electrical Performance 220 µF nominal capacitance with ±20% tolerance and a rated voltage of 50 V. Specified tangent of loss angle (tan δ) of 0.10 at 20 °C, 120 Hz.
• Ripple Current Capability Low‑frequency ripple current of 350 mA at 120 Hz and high‑frequency ripple current of 700 mA at 10 kHz, supporting demanding power filtering duties.
• Leakage and Reliability Specified leakage current of 110 µA and an endurance rating of 5,000 hours at 105 °C under rated voltage.
• Thermal Range & Stability Operating temperature from −55 °C to 105 °C with defined impedance stability across low‑temperature conditions.
• Package & Assembly φ10 × 10L package (1.00 × 1.00 cm) in a radial, can‑style SMD case, supplied in embossed carrier taping for automatic placement; recommended land size 1.03 × 1.03 cm.
• Qualification & Compliance AEC‑Q200 rated and RoHS compliant for regulated environments and reliability‑focused designs.

Typical Applications

• Automotive Electronics Suitable for automotive systems where AEC‑Q200 qualification, 50 V rating and long endurance at elevated temperature are required.
• High‑Density Power Modules Designed for surface‑mount placement on compact, densely populated PCBs for board‑level bulk and decoupling.
• Power Filtering and Energy Storage Used where 220 µF capacitance with defined ripple handling (350 mA @120 Hz, 700 mA @10 kHz) and low leakage current are needed.

Unique Advantages

• Low‑Impedance Chip Construction: Enables effective decoupling and smoothing on high‑density boards while maintaining compact footprint.
• High Ripple Tolerance: Dual ripple ratings for low and high frequencies support a range of power conversion and filtering scenarios.
• Long Endurance at Elevated Temperature: 5,000 hours at 105 °C provides predictable long‑term performance in thermally demanding environments.
• AEC‑Q200 Qualification: Qualification suited to reliability‑focused and regulated applications, including automotive electronics.
• Carrier Tape Packaging: Supplied in embossed carrier taping for compatibility with automated placement and high‑volume production.
• RoHS Compliant: Meets RoHS requirements for restricted substances.

Why Choose UCD1H221MNL1GS?

UCD1H221MNL1GS combines a compact chip‑type SMD form factor with low‑impedance electrical characteristics, a 50 V rating, and robust endurance at elevated temperature. Its AEC‑Q200 qualification and RoHS compliance position it for use in designs where reliability, long life, and regulatory adherence matter.

This part is suitable for engineers and procurement teams specifying capacitors for high‑density power modules, automotive electronics, and other applications that demand reliable bulk capacitance, controlled loss (tan δ), and defined ripple performance in a surface‑mount package supplied for automated assembly.

If you need pricing, availability, or to request a quote for UCD1H221MNL1GS, please submit an inquiry to our sales team and include your required quantity and delivery timeframe.