UCD1H330MCL1GS

The UCD1H330MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor configured for surface-mount assembly. It delivers 33 µF capacitance at a 50 V rating in a compact φ6.3 × 7.7 mm SMD can designed for high‑density PCBs.

Targeted for applications that demand robust temperature performance and documented endurance, this part carries AEC‑Q200 qualification, RoHS compliance, and an operating range from −55 °C to 105 °C—providing a reliable capacitor option for automotive and other demanding electronic systems.

Key Features

• Core Electricals — 33 µF capacitance with ±20% tolerance and a 50 V rated voltage, suitable for compact SMD designs requiring moderate bulk capacitance.
• Low‑Loss, Low‑Impedance Design — tan δ = 0.10 measured at 20 °C, 120 Hz and 50 V, supporting lower ESR profiles in space‑constrained layouts.
• Ripple Current Handling — Rated ripple current of 97.5 mA at 120 Hz and 195 mA at 10 kHz for both low‑ and high‑frequency ripple conditions.
• Low Leakage — Leakage current of 16.5 µA, enabling predictable standby and bias behavior in power circuits.
• High‑Temperature Endurance — Endurance specified at 2000 hours at 105 °C, supporting sustained elevated‑temperature operation.
• Package & Mounting — Chip type radial can SMD (φ6.3 × 7.7 mm) supplied in embossed carrier taping for automated placement on high‑density PC boards.
• Compliance & Qualification — RoHS compliant and AEC‑Q200 qualified, indicating suitability for regulated production and automotive design flows.

Typical Applications

• Automotive Electronics — Designed for automotive use with AEC‑Q200 qualification and an operating temperature range of −55 °C to 105 °C for ECU and in‑vehicle electronics.
• High‑Density SMD PCBs — Chip type construction and embossed carrier taping enable placement on compact, densely populated boards.
• RoHS‑Compliant Production — RoHS status supports deployment in regulated manufacturing environments and assemblies.

Unique Advantages

• AEC‑Q200 Qualification: Provides documented suitability for automotive design processes and validation requirements.
• Compact SMD Can: φ6.3 × 7.7 mm chip form factor minimizes board footprint while providing 33 µF of capacitance for space‑constrained designs.
• Low‑Loss Performance: tan δ = 0.10 at 120 Hz (50 V) helps reduce dissipation and supports stable impedance behavior in AC conditions.
• Measured Ripple Capability: Defined ripple currents at 120 Hz and 10 kHz (97.5 mA and 195 mA respectively) give clear design targets for filtering and decoupling use cases.
• High‑Temperature Endurance: 2000 hours at 105 °C specification supports long‑term reliability under elevated operating temperature.
• Automated Assembly Ready: Embossed carrier taping and SMD format enable efficient pick‑and‑place processing for high‑volume production.

Why Choose UCD1H330MCL1GS?

UCD1H330MCL1GS combines a compact chip can, low‑impedance electrical behavior and defined ripple/leakage characteristics with AEC‑Q200 qualification and RoHS compliance. These attributes make it well suited to design teams seeking a small‑form, automotive‑grade electrolytic capacitor for high‑density surface‑mount assemblies.

Engineers specifying this part benefit from clear electrical parameters (capacitance, tan δ, leakage, ripple current), a broad −55 °C to 105 °C operating range, and a documented endurance rating—supporting robust, predictable performance over product life in demanding environments.

For pricing, availability, or to request a quote for UCD1H330MCL1GS, please submit a quote request or contact our sales team for assistance.