UCD1H220MCL1GS

The UCD1H220MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount assembly and high‑density PCBs. With a 22 µF capacitance at 50 V and a compact φ6.3 × 5.8 mm package, it targets applications that require stable decoupling and energy storage in constrained board space.

Built for continuous operation across −55 °C to +105 °C and qualified to AEC‑Q200, this part combines small footprint, controlled loss (tan δ), and high‑temperature endurance for demanding embedded and automotive electronics.

Key Features

• Capacitance & Tolerance: 22 µF nominal with ±20% tolerance at 120 Hz, 20 °C, providing predictable decoupling and bulk capacitance.
• Rated Voltage: 50 V working voltage suitable for mid‑rail power rails and power conversion stages.
• Low impedance chip type: Specified impedance of 860 mΩ and a low tan δ of 0.10 (measured at 120 Hz, 20 °C), optimized for minimizing AC loss in decoupling applications.
• Ripple current capability: 85 mA at 120 Hz (low frequency) and 170 mA at 10 kHz (high frequency) to support ripple handling in DC‑DC converters and power filters.
• Leakage current: Low leakage current rated at 11 µA, aiding low‑power and standby performance.
• Thermal and endurance rating: Operating range −55 °C to +105 °C with a life/endurance rating of 2000 hours at 105 °C.
• Package & mounting: Chip‑type radial can for SMD (φ6.3 × 5.8 mm) supplied in embossed carrier taping for pick‑and‑place automation; recommended land size 6.6 × 6.6 mm.
• Compliance & qualification: AEC‑Q200 rated and RoHS compliant for regulated markets.

Typical Applications

• Automotive electronics: Suitable for board‑level decoupling and smoothing in automotive control modules that require AEC‑Q200 qualified components and extended temperature range.
• Power conversion: Used on DC‑DC converter outputs and buck/boost stages to handle ripple and stabilize voltage rails in compact power supplies.
• Embedded systems: Provides local bulk capacitance and noise suppression on high‑density PCBs where small footprint and automated placement are required.

Unique Advantages

• Compact, high‑temperature chip format: φ6.3 × 5.8 mm SMD can enables high‑density layouts while supporting operation up to 105 °C.
• Measured low loss (tan δ = 0.10): Defined loss tangent at 120 Hz and 20 °C ensures predictable AC behavior for filter and decoupling designs.
• Dual‑band ripple capability: Separate ripple specifications at 120 Hz and 10 kHz (85 mA / 170 mA) simplify selection for both line‑frequency and switching environments.
• Automotive‑grade qualification: AEC‑Q200 rating and RoHS compliance support use in regulated and safety‑conscious designs.
• Automation‑ready packaging: Embossed carrier taping supports high‑volume pick‑and‑place assembly for efficient manufacturing.

Why Choose UCD1H220MCL1GS?

The UCD1H220MCL1GS balances a small SMD footprint with electrical characteristics engineered for reliable decoupling and ripple handling in temperature‑stressful environments. Its low impedance, controlled tan δ, and dual ripple ratings make it practical for power rails in embedded and automotive systems where board space and thermal performance matter.

Designed by Nichicon as part of the UCD series, this capacitor is aimed at engineers specifying compact, AEC‑Q200 rated components that must perform across −55 °C to +105 °C while supporting automated assembly and consistent electrical behavior over its 2000‑hour endurance rating at 105 °C.

For pricing, lead‑time, or to request a quote for UCD1H220MCL1GS, please contact sales or request a formal quote through the supplier channel.