UCD1E470MCL1GS

The UCD1E470MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount, high‑density PCB applications. It provides 47 µF capacitance at a 25 V rating with low loss characteristics and targeted ripple handling for power filtering and decoupling.

Engineered for demanding temperature and endurance requirements, this SMD capacitor supports operation from −55 °C to +105 °C, carries AEC‑Q200 qualification, and is supplied in embossed carrier taping for automated assembly.

Key Features

• Electrical Performance — 47 µF capacitance at a 25 V rated voltage with a tolerance of −20% to +20%. Measured dissipation factor (tan δ) is 0.14 at 20 °C, 120 Hz and impedance is specified at 360 mΩ.
• Ripple Handling — Low‑frequency ripple current 120 mA (120 Hz) and high‑frequency ripple current 240 mA (10 kHz), enabling effective smoothing and decoupling in power circuits.
• Leakage and Loss — Rated leakage current 11.75 µA and low dissipation factor to maintain efficiency in power applications.
• Thermal and Endurance — Operating temperature range from −55 °C to +105 °C and rated endurance of 2000 hours at 105 °C per the product specification.
• Qualification & Reliability — AEC‑Q200 qualified and RoHS compliant, supporting applications with elevated reliability and regulatory requirements.
• Package & Mounting — Chip/can SMD package with dimensions φ6.3 × 5.8 mm and surface‑mount land recommended 6.6 × 6.6 mm; supplied in embossed carrier taping compatible with automatic placement.
• Polarized — Polarized aluminum electrolytic design for standard power and filtering topologies.

Typical Applications

• Automotive power modules — AEC‑Q200 qualification and −55 °C to +105 °C operating range support use in vehicle power filtering and decoupling functions.
• DC‑DC converters — Low impedance and defined ripple current ratings make this capacitor suitable for input/output smoothing and transient suppression in switching regulators.
• High‑density SMD power assemblies — Compact φ6.3 × 5.8 mm SMD package and embossed carrier taping streamline automated placement on densely populated PCBs.
• Industrial power supplies — Temperature endurance and 2000‑hour life at 105 °C provide stability for continuous operation in industrial power systems.

Unique Advantages

• Low impedance for tighter filtering: Specified 360 mΩ impedance and tan δ 0.14 at 120 Hz support improved power rail stability and reduced ripple.
• Compact SMD form factor: φ6.3 × 5.8 mm size with standardized land pattern (6.6 × 6.6 mm) enables space‑efficient designs on high‑density boards.
• Automated assembly ready: Embossed carrier taping and chip‑type SMD packaging facilitate pick‑and‑place manufacturing flows.
• High temperature endurance: Rated for −55 °C to +105 °C with 2000 hours at 105 °C, suitable for applications requiring prolonged thermal stability.
• Industry qualification: AEC‑Q200 qualification and RoHS compliance address regulatory and reliability requirements for regulated markets.

Why Choose UCD1E470MCL1GS?

The UCD1E470MCL1GS delivers a balanced combination of low impedance, compact SMD packaging, and temperature endurance for reliable power filtering and decoupling. Its AEC‑Q200 qualification and embossed carrier taping make it appropriate for designs that require both high reliability and automated manufacturing.

This part is suited for engineers specifying capacitors in automotive, industrial, and other applications where stable capacitance, controlled loss, and defined ripple capability are required. Mass production availability supports consistent supply for volume designs.

Request a quote or contact sales to discuss availability, pricing, and how UCD1E470MCL1GS can fit into your next design.