UCD1E331MNL1GS

The UCD1E331MNL1GS is a surface-mount aluminum electrolytic capacitor in Nichicon's UCD series, designed as a chip-type, low-impedance component for board-level power applications. It delivers 330 µF capacitance at a 25 V rating with a polarized construction and is available in embossed carrier tape for automated assembly.

Engineered for robust operation across a wide temperature range and qualified to AEC‑Q200, this part targets high-density surface-mount assemblies that require reliable ripple handling, low loss, and extended endurance in demanding environments. Status: Mass Production.

Key Features

• Capacitance and Voltage — 330 µF nominal capacitance with a rated voltage of 25 V and a capacitance tolerance of −20% to +20%.
• Low Loss, Low Impedance — tan δ (DF) of 0.14 measured at 20°C, 120 Hz, providing predictable loss characteristics for power filtering applications.
• Ripple Current Performance — Handles 300 mA at 120 Hz (low frequency) and 600 mA at 10 kHz (high frequency), supporting board-level power smoothing and decoupling duties.
• Leakage Current — Specified leakage current is 82.5 µA, enabling controlled standby behavior in powered systems.
• Temperature and Endurance — Operating range from −55°C to +105°C with endurance rated to 5000 hours at 105°C for long-term reliability under elevated temperature conditions.
• Package and Mounting — Chip-type radial can SMD (φ8 × 10L) designed for surface mounting on high-density PCBs; supplied in embossed carrier taping for automated placement. Surface-mount land size: 8.3 × 8.3 mm.
• Compliance — RoHS compliant and AEC‑Q200 qualified.

Typical Applications

• Automotive Electronics — Suitable for electronic modules in automotive systems where AEC‑Q200 qualification and operation to 105°C are required.
• High-Density SMD Assemblies — Designed for surface mounting on densely populated PCBs where a compact 330 µF, 25 V capacitor is needed.
• Automated Production — Embossed carrier taping format enables automated pick-and-place for high-volume manufacturing.

Unique Advantages

• AEC‑Q200 Qualification: Provides a verified reliability baseline for automotive and other demanding applications.
• High Capacitance in SMD Chip Form: Delivers 330 µF in a compact φ8 × 10L package for space-constrained board designs.
• Balanced Ripple Handling: Specified ripple current at both low and high frequencies supports filtering across a range of switching and line-frequency conditions.
• Extended High-Temperature Endurance: Rated for 5000 hours at 105°C, supporting long-term operation in elevated-temperature environments.
• Surface-Mount Production Ready: Embossed carrier taping and chip-type design simplify integration into automated assembly workflows.
• Controlled Loss and Leakage: Low tan δ (0.14 at 20°C, 120 Hz) and specified leakage current (82.5 µA) enable predictable power management behavior.

Why Choose UCD1E331MNL1GS?

The UCD1E331MNL1GS combines a high 330 µF capacitance and 25 V rating with a chip-type, low-impedance design tailored for surface-mount, high-density PCB layouts. Its AEC‑Q200 qualification, wide operating temperature range (−55°C to +105°C), and 5000-hour endurance at 105°C make it appropriate for demanding environments that require both performance and reliability.

This part is well suited to designers and manufacturers seeking a robust, production-ready aluminum electrolytic solution that integrates with automated assembly processes and offers defined electrical characteristics for board-level power filtering and decoupling.

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