UCD1K330MNS1GS

The UCD1K330MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It targets automotive and other demanding applications that require a compact surface-mount capacitor with wide operating temperature range and industry qualification.

Key value comes from its low-impedance chip construction, rated performance at up to +105°C, compatibility with automatic carrier-tape mounting, and AEC-Q200 qualification combined with RoHS compliance.

Key Features

• Core Type: Chip-type aluminum electrolytic construction optimized for low impedance and stable performance in surface-mount assemblies.
• Capacitance & Voltage: 33 µF capacitance with an 80 V rated voltage and ±20% tolerance at 120 Hz, 20°C.
• Temperature Range & Endurance: Rated for operation from -55°C to +105°C with a specified lifetime of 2000 hours at 105°C for this voltage/size class.
• Low-Impedance Performance: Designed for low impedance across temperature, supporting reliable filtering and decoupling in temperature-variable environments.
• Ripple Current Ratings: 65 mA at 120 Hz and 130 mA at 10 kHz, enabling use where controlled ripple handling is required.
• Package & Mounting: Surface-mount radial can (SMD) package, compatible with automatic mounting machines fed by carrier tape and designed for high-density PCB layouts. Surface-mount land size: 8.3 × 8.3 mm.
• Reliability & Qualification: AEC-Q200 qualified for automotive-grade reliability and designed to meet endurance, leakage, and tan δ limits after high-temperature stress.
• Environmental Compliance: RoHS compliant (2011/65/EU, (EU)2015/863).
• Polarized Device: Polar capacitor construction—observe polarity during assembly and operation.

Typical Applications

• Automotive electronic modules: Suitable for use on high-density PCBs in vehicle electronic control modules where AEC-Q200 qualification and extended temperature range are required.
• Power supply filtering on compact boards: Surface-mount chip form factor and low impedance make it appropriate for bulk or smoothing functions on tightly packed PCBs.
• High-density SMD assemblies: Designed for automatic carrier-tape mounting and placement in high-density surface-mounted layouts.

Unique Advantages

• AEC-Q200 Qualification: Provides assurance of automotive-grade reliability for designs that require recognized component qualification.
• Wide Temperature Operation: Rated from -55°C to +105°C, enabling performance across harsh thermal environments common in automotive and industrial applications.
• Low-Impedance Chip Construction: Helps maintain stable impedance characteristics across temperature, improving filtering and decoupling effectiveness on the board.
• Mounting and Assembly Friendly: Designed for automatic mounting with carrier tape feeding, simplifying high-volume surface-mount production on dense PCBs.
• Traceable Ripple Ratings: Specified ripple current at both low and high frequencies (65 mA at 120 Hz, 130 mA at 10 kHz) to support design margining for ripple-handling requirements.
• Regulatory Compliance: RoHS compliance supports environmental and supply-chain requirements.

Why Choose UCD1K330MNS1GS?

The UCD1K330MNS1GS balances compact surface-mount packaging and low-impedance aluminum electrolytic performance with qualifications suited to automotive-grade designs. Its combination of 33 µF at 80 V, wide operating temperature range, controlled ripple ratings, and AEC-Q200 qualification make it a practical component for engineers specifying capacitors for demanding SMD assemblies.

This part is well suited for teams designing high-density PCBs that require reliable, automatic assembly compatibility and verified performance after elevated-temperature endurance testing—delivering predictable electrical behavior and regulatory compliance across production and field use.

To request a quote or submit a specification inquiry for UCD1K330MNS1GS, please contact sales or request a formal quotation through your procurement channel.