UCK1E292MNJ1MS
| Part Description |
2900 µF 25 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,579 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCK |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 2.9 mF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 1.75 cm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 5000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 1.91 A @ 10 kHz | Ripple Current Low Frequency | 955 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 16.5 x 16 mm | Surface Mount Land Size | 16.3 x 16.3 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UCK1E292MNJ1MS – Chip Type Low-Impedance Aluminum Electrolytic Capacitor, 25 V, 2.9 mF
The UCK1E292MNJ1MS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 2.9 mF capacitance at a 25 V rating with a polarized configuration and is optimized for automated placement using carrier tape.
Engineered for demanding environments, this capacitor supports a wide operating temperature range (−55°C to +105°C) and carries AEC-Q200 qualification, making it suitable for automotive and other reliability-focused applications where stable smoothing and decoupling are required.
Key Features
- Capacitance & Voltage — 2.9 mF nominal capacitance at a 25 V rated voltage with ±20% tolerance for bulk energy storage and power-rail smoothing.
- Low Impedance Performance — Chip-type low-impedance construction for improved ripple handling and transient response.
- Ripple Current Capability — Rated for 955 mA at 120 Hz and 1.91 A at 10 kHz to support high ripple environments and switching power supplies.
- Temperature & Lifetime — Operating range −55°C to +105°C with endurance specified as 5000 hours at 105°C, supporting long-term reliability under elevated temperatures.
- Automotive-Grade Qualification — AEC-Q200 qualified and noted for automotive applications in the product data.
- Surface-Mount Package — Surface-mount, radial can (SMD) package with physical dimensions L: 1.65 × D: 1.6 cm and a specified surface-mount land size of 1.63 × 1.63 cm; suitable for automated tape-fed placement.
- Regulatory Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).
Typical Applications
- Automotive Electronics — Use for power-rail decoupling and smoothing in automotive control modules where AEC-Q200 qualification and extended temperature range are required.
- Power Supply Filtering — Bulk filtering and ripple suppression in DC–DC converters and regulator outputs, leveraging high ripple current ratings.
- Embedded Systems — Energy storage and transient buffering for microcontroller power domains and board-level decoupling in robust designs.
Unique Advantages
- Designed for Automated Assembly: Carrier-tape compatibility and an SMD can package enable reliable high-volume placement and consistent board-level yield.
- High Ripple Current Handling: Specified ripple currents at 120 Hz and 10 kHz reduce heating and extend system reliability in switching environments.
- Wide Temperature Endurance: −55°C to +105°C operation and 5000-hour endurance at 105°C provide predictable performance in thermal-stressed applications.
- AEC-Q200 Qualification: Qualification per AEC-Q200 supports deployment in automotive-grade designs requiring recognized component qualification.
- RoHS Compliance: Meets RoHS directives for use in environmentally regulated product lines.
Why Choose UCK1E292MNJ1MS?
The UCK1E292MNJ1MS combines a high capacitance (2.9 mF) and low-impedance chip architecture with automotive-grade qualification and extended temperature endurance. It is positioned for designs that require robust bulk energy storage, reliable ripple handling, and compatibility with automated surface-mount assembly.
This part is well suited to engineers developing automotive electronics, power supplies, and embedded systems that demand predictable long-term performance and straightforward board-level integration backed by clear electrical and environmental specifications.
If you would like pricing or availability, request a quote or submit a quote request to our sales team and provide your project details so we can assist with lead times and volume pricing.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016