UCL1C331MNL1GS

The UCL1C331MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount assemblies. It delivers 330 µF at 16 V in a compact radial can SMD package and is designed for automatic mounting machine use (carrier‑tape fed).

Engineered for demanding environments, this part offers a wide operating temperature range (‑55 °C to +105 °C), AEC‑Q200 qualification, and RoHS compliance, making it suitable for automotive electronics and other applications that require robust thermal and electrical performance.

Key Features

• Core Electrical — 330 µF nominal capacitance at 16 V with ±20% tolerance provides bulk energy storage and decoupling in compact footprints.
• Low Impedance & Ripple Handling — Specified impedance of 80 mΩ and ripple current ratings of 425 mA (120 Hz) and 850 mA (10 kHz) support stable power rails and noise suppression.
• High Temperature Endurance — Rated for operation from ‑55 °C to +105 °C with a guaranteed endurance of 2000 hours at 105 °C.
• Reliability & Leakage — AEC‑Q200 Qualified and leakage current spec of not more than 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20 °C.
• Package & Assembly — Radial can SMD (chip type) designed for surface‑mount placement; compatible with automatic mounting machines and supplied on carrier tape. Surface mount land size: 8.3 × 8.3 mm. Physical size: L 1 × D 0.8 cm.
• Regulatory — Compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Designed for electronic modules that require AEC‑Q200 qualification and extended temperature range.
• Surface‑Mount Power Modules — Bulk energy storage and smoothing in compact SMD power assemblies where low impedance and ripple handling matter.
• High‑Throughput Manufacturing — Carrier‑tape compatibility and chip‑type SMD packaging simplify placement for automated assembly lines.

Unique Advantages

• Low impedance improves power stability: 80 mΩ impedance helps reduce voltage ripple and maintain stable power rails.
• Proven high‑temperature endurance: 2000 hours at 105 °C provides predictable lifetime for thermally stressed designs.
• Automotive‑grade qualification: AEC‑Q200 qualification supports use in automotive electronic modules that demand component-level reliability.
• Compact SMD form factor: Chip‑type radial can enables high capacitance in a small L 1 × D 0.8 cm footprint suitable for dense PCBs.
• Manufacturing friendly: Carrier‑tape feed compatibility and standard surface‑mount land pattern (8.3 × 8.3 mm) streamline automated placement.
• Regulatory compliance: RoHS compliance simplifies environmental and regulatory approvals.

Why Choose UCL1C331MNL1GS?

UCL1C331MNL1GS combines a high capacitance density with low impedance and automotive‑grade qualification, making it a strong choice for designers seeking reliable bulk capacitance in surface‑mount power subsystems. Its specified ripple current capability and long high‑temperature endurance support stable performance in thermally demanding environments.

This part is suited to engineering teams and procurement groups building robust, manufacturable power electronics—particularly where AEC‑Q200 qualification, compact SMD packaging, and compatibility with automatic mounting are important for production and lifecycle reliability.

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