UCL1V100MCL6GS

The UCL1V100MCL6GS is a surface‑mount aluminum electrolytic capacitor from Nichicon’s UCL series, designed as a chip‑type, low‑impedance solution for compact assemblies. It combines a 10 µF capacitance with a 35 V rating and a small φ4 × 5.8 mm case for space‑constrained designs.

Engineered for demanding temperature environments and automated production, this part delivers specified performance across −55 °C to 105 °C, AEC‑Q200 qualification, and embossed carrier taping for pick‑and‑place compatibility.

Key Features

• Capacitance & Voltage — 10 µF rated capacitance with a 35 V rated voltage and tolerance of −20% to +20%.
• Low Impedance Performance — Specified impedance of 850 mΩ and a tangent of loss angle (tanδ) of 0.12 at 20 °C, 120 Hz for efficient AC behavior.
• Ripple Current Handling — Low‑frequency ripple current of 80 mA at 120 Hz and high‑frequency ripple current of 160 mA at 10 kHz to support transient and switching applications.
• Leakage Current — Specified leakage current of 3.5 µA, supporting low‑leakage designs.
• Thermal & Endurance — Operating temperature range −55 °C to 105 °C with an endurance rating of 2000 hours at 105 °C.
• Compact SMD Package — Chip‑type radial can SMD package, size φ4 × 5.8 mm, with recommended land pattern 4.3 × 4.3 mm for high‑density PCB layouts.
• Manufacturing‑Ready — Supplied in embossed carrier taping and suitable for automatic mounting machines; part is in mass production.
• AEC‑Q200 Qualified — Rated for applications requiring industry reliability standards for electronic components.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and operation up to 105 °C make this capacitor suitable for automotive electronic modules requiring a 10 µF, 35 V SMD capacitor.
• Surface‑Mount Production — Embossed carrier taping and chip‑type package support automated pick‑and‑place assembly for high‑volume manufacturing.
• Compact Power Modules — Small φ4 × 5.8 mm case and 4.3 × 4.3 mm land size suit compact boards where PCB area is constrained.

Unique Advantages

• Space‑efficient form factor: φ4 × 5.8 mm chip package enables high component density without sacrificing capacitance.
• High‑temperature endurance: Rated for 2000 hours at 105 °C, providing predictable lifetime behavior in elevated ambient conditions.
• Automotive‑grade reliability: AEC‑Q200 qualification aligns the part with automotive reliability expectations for electronic modules.
• Low AC loss: tanδ of 0.12 (120 Hz, 20 °C) and 850 mΩ impedance support efficient filtering in AC and switching environments.
• Production ready: Embossed carrier taping and SMD chip construction simplify automated placement and reduce assembly overhead.
• Controlled leakage: Specified leakage current of 3.5 µA supports designs where low standby current is required.

Why Choose UCL1V100MCL6GS?

UCL1V100MCL6GS positions itself as a compact, low‑impedance aluminum electrolytic capacitor tailored for designs that demand reliable operation across a wide temperature range and compatibility with automated SMD assembly. Its combination of 10 µF capacitance at 35 V, measurable ripple current capability, low leakage, and AEC‑Q200 qualification makes it suitable for robust electronic modules where space and thermal endurance are key concerns.

This part is ideal for engineers and procurement teams building high‑density power and control circuits that require predictable performance over life and temperature, plus the manufacturing convenience of embossed carrier taping for high‑volume assembly.

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