UCM1C331MCL1GS

The UCM1C331MCL1GS is a chip-type, surface-mount aluminum electrolytic capacitor from Nichicon’s UCM series. It delivers 330 µF nominal capacitance at a 16 V rating in a compact φ6.3 × 7.7 mm can-style SMD package designed for automated assembly.

Designed for demanding temperature and reliability requirements, this part supports operation from −55 °C to 105 °C, carries AEC-Q200 qualification, and is supplied in embossed carrier taping for pick-and-place production.

Key Features

• Capacitance and Voltage — 330 µF nominal capacitance with a rated voltage of 16 V and capacitance tolerance of −20% to +20%.
• Chip-Type, Low Impedance — UCM series chip construction optimized for low impedance performance at 120 Hz (tan δ 0.16 at 20 °C, 120 Hz for 16 V).
• Temperature and Endurance — Operating range −55 °C to 105 °C with rated endurance of 2000 hours at 105 °C.
• Ripple Current Capability — Handles low-frequency ripple current of 300 mA (120 Hz) and high-frequency ripple current of 600 mA (10 kHz).
• Leakage and Polarization — Polarized aluminum electrolytic construction with specified leakage current of 52.8 µA.
• Surface-Mount Packaging — φ6.3 × 7.7 mm can, surface-mount land size 6.6 × 6.6 mm, supplied in embossed carrier taping for automated placement.
• Quality and Compliance — AEC-Q200 qualified and RoHS compliant.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and 105 °C endurance make this capacitor suitable for vehicle-grade electronic modules that require reliable bulk capacitance.
• Board-level power modules — Compact φ6.3 × 7.7 mm SMD package provides substantial capacitance in space-constrained power assemblies.
• Automated SMT production — Delivered in embossed carrier tape and compatible with automatic mounting equipment for high-volume assembly.

Unique Advantages

• Vehicle-grade qualification: AEC-Q200 status supports use where automotive reliability standards are required.
• High-temperature endurance: Rated for 2000 hours at 105 °C, enabling stable performance in elevated-temperature environments.
• High capacitance in a small footprint: 330 µF in a φ6.3 × 7.7 mm SMD can helps minimize board area for bulk capacitance needs.
• Low-impedance behavior: Chip-type low impedance construction with specified tan δ supports effective AC performance at 120 Hz.
• Manufacturing-ready packaging: Embossed carrier taping simplifies integration into automated pick-and-place assembly lines.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for modern electronics manufacturing.

Why Choose UCM1C331MCL1GS?

UCM1C331MCL1GS combines a compact chip-type SMD package with 330 µF capacitance and 16 V rating to deliver reliable bulk energy storage for space-constrained designs. Its low-impedance construction, high-frequency ripple capability, and specified endurance at 105 °C make it suitable for applications requiring sustained performance at elevated temperatures.

Backed by Nichicon’s UCM series specifications and supplied for automated assembly, this part is positioned for engineers and purchasers seeking a vetted, vehicle-capable aluminum electrolytic solution for PCB-level power systems.

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