UCM1E221MCL1GS

The UCM1E221MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. It provides 220 µF of capacitance at a 25 V rating in a compact φ6.3 × 7.7 mm radial can SMD package.

Built for demanding temperature and reliability requirements, this part supports an operating range of -55 °C to 105 °C, is AEC-Q200 qualified, and is supplied on embossed carrier tape for automated placement—making it suitable for automotive and other high-reliability surface-mount applications.

Key Features

• Capacitance and Voltage — 220 µF nominal capacitance with a rated voltage of 25 V and a tolerance of -20% to +20%.
• Low Impedance Performance — Chip-type, low-impedance construction with a specified tan δ (DF) of 0.14 measured at 20 °C, 120 Hz (25 V rating).
• Ripple Current Capability — Low-frequency ripple current of 300 mA at 120 Hz and high-frequency ripple current of 600 mA at 10 kHz, supporting ripple handling across frequency ranges.
• Leakage Current — Specified leakage current of 55 µA (measurement condition noted in product data).
• Temperature and Endurance — Operating temperature range from -55 °C to 105 °C with endurance rated at 2000 hours at 105 °C.
• Automotive-Grade Reliability — AEC-Q200 qualified for applications requiring defined automotive-level qualification.
• Surface-Mount Package & Assembly — Compact φ6.3 × 7.7 mm footprint with surface-mount radial can construction and embossed carrier taping for automatic placement; recommended land size 6.6 × 6.6 mm.
• RoHS Compliant — Conforms to RoHS requirements per product data.

Typical Applications

• Automotive Electronics — AEC-Q200 qualified, chip-type SMD capacitor for electronic modules that require stable capacitance and defined thermal endurance up to 105 °C.
• Power Supply Modules — 220 µF at 25 V with specified ripple-current ratings suitable for board-level power filtering and decoupling on 25 V rails in surface-mount designs.
• Board-Level Surface-Mount Assemblies — Compact radial can SMD in embossed carrier tape for automated pick-and-place and high-density PCB layouts.

Unique Advantages

• Compact, high-capacitance SMD form factor — 220 µF in a φ6.3 × 7.7 mm package reduces PCB area compared to larger can options.
• Defined high-temperature endurance — Rated for 2000 hours at 105 °C, providing predictable life performance in elevated-temperature environments.
• Frequency-flexible ripple handling — Separate low- and high-frequency ripple-current specifications (300 mA at 120 Hz, 600 mA at 10 kHz) for mixed-frequency power systems.
• AEC-Q200 qualification — Delivered with automotive-level qualification status for designs that require defined component reliability.
• Assembly-ready packaging — Supplied on embossed carrier tape to streamline automated placement and throughput.
• Low-impedance characterization — Specified tan δ (DF) and impedance behaviour for designers who need measurable AC loss characteristics at 120 Hz.

Why Choose UCM1E221MCL1GS?

The UCM1E221MCL1GS combines a compact chip-type SMD package with low-impedance aluminum electrolytic performance, making it a practical choice for surface-mount designs that require 220 µF at 25 V and reliable operation across -55 °C to 105 °C. With defined ripple-current specifications, controlled leakage, and a 2000-hour endurance rating at 105 °C, it offers predictable behavior for temperature-stressed and vibration-tolerant assemblies.

This part is suited to engineers and procurement teams specifying capacitors for automotive and other high-reliability electronic modules where AEC-Q200 qualification, automated assembly compatibility, and clear electrical/thermal specifications are required.

If you would like pricing, availability, or a formal quote for UCM1E221MCL1GS, submit a request and our team will respond with component sourcing and lead-time information.