UCM1H112MNS1MS

The UCM1H112MNS1MS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount can designed for automated assembly. It provides 1.1 mF (1100 µF) capacitance at a 50 V rating with a compact φ18 × 16.5 mm package footprint.

Engineered for demanding environments, this capacitor offers high ripple-current capability, long endurance (5000 hours at 105°C), AEC-Q200 qualification, and vibration resistance — making it suited for automotive and other high-reliability applications that require robust power smoothing and thermal durability.

Key Features

• Capacitance & Voltage: 1.1 mF (1100 µF) nominal capacitance with a 50 V rated voltage and ±20% tolerance at 20°C, 120 Hz.
• Low Impedance Design: Low impedance construction with tanδ (DF) 0.1 measured at 20°C, 120 Hz, supporting stable performance in power circuits.
• High Ripple Current Capability: Rated low-frequency ripple current of 990 mA at 120 Hz and high-frequency ripple current of 1.98 A at 10 kHz, enabling effective filtering under dynamic load conditions.
• Long Endurance & Wide Temperature Range: Life rating of 5000 hours at 105°C and an operating temperature range of −55°C to 105°C for prolonged, high-temperature operation.
• Reliability & Automotive Qualification: AEC-Q200 qualified and vibration resistant for applications requiring industry-recognized reliability standards.
• Surface-Mount Package & Assembly Friendly: Chip-type radial can (SMD) with embossed carrier taping for use with automatic mounting machines; surface mount land size specified as 1.83 × 1.83 cm.
• Low Leakage: Specified leakage current of 550 µA after initial application of rated voltage (per product data).
• Mass Production Availability: Product status listed as mass production for supply-chain planning.

Typical Applications

• Automotive electronics — Intended for automotive applications with AEC-Q200 qualification and an operating range of −55°C to 105°C.
• Surface-mount manufacturing — Embossed carrier taping and chip-type SMD can package for automated pick-and-place assembly.
• High-temperature, long-life systems — 5000-hour endurance at 105°C supports use in modules exposed to elevated operating temperatures.

Unique Advantages

• High capacitance in an SMD can: 1100 µF in a φ18 × 16.5 mm chip-type package reduces board area compared with equivalent through-hole solutions.
• Robust ripple handling: Specified ripple currents at both low and high frequency (990 mA @120 Hz, 1.98 A @10 kHz) enable effective decoupling across a wide frequency range.
• Designed for elevated-temperature endurance: 5000 hours at 105°C provides predictable lifetime behavior in hot operating environments.
• Automotive-grade reliability: AEC-Q200 qualification and vibration resistance support deployment in safety- and reliability-conscious systems.
• Assembly-ready packaging: Embossed carrier taping facilitates automated placement and higher throughput on production lines.

Why Choose UCM1H112MNS1MS?

UCM1H112MNS1MS combines high capacitance, low impedance characteristics, and robust thermal endurance in an SMD chip-type can tailored for automated manufacturing. Its AEC-Q200 qualification, vibration resistance, and defined ripple-current capability make it a practical choice for designers targeting reliable power smoothing in harsh environments.

This capacitor is suited to engineers and procurement teams specifying components for automotive and other high-reliability systems that require verified endurance at elevated temperatures, automated assembly compatibility, and predictable electrical performance over time.

Request a quote or submit a parts inquiry for UCM1H112MNS1MS to check availability and receive pricing and lead-time information.