A3P030-2QNG68I

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 1,002 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates30000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3P030-2QNG68I – ProASIC3 FPGA, 49 I/O, 68-VFQFN

The A3P030-2QNG68I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a mid-density programmable logic option with 768 logic elements and 30,000 gates in a compact QFN package.

Designed for industrial-grade applications, this device features up to 49 general-purpose I/O, a 68-VFQFN exposed-pad (68-QFN 8×8 mm) surface-mount footprint, a core supply range of 1.425 V to 1.575 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic 768 logic elements (cells) and 30,000 gates provide programmable combinational and sequential resources for custom digital functions.
  • I/O 49 available I/O pins to interface with surrounding devices and system peripherals.
  • Power Specified core voltage range of 1.425 V to 1.575 V for consistent low-voltage operation.
  • Package & Mounting 68-VFQFN exposed-pad package; supplier device package listed as 68-QFN (8×8) for compact surface-mount PCB designs.
  • Temperature & Grade Industrial grade with an operating temperature from −40 °C to 100 °C for use in demanding environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Programmable logic capacity and industrial temperature rating make this device suitable for control and automation circuitry.
  • Compact Embedded Logic — 68-QFN (8×8 mm) exposed-pad package and surface-mount mounting support space-constrained PCB layouts.
  • I/O Expansion and Interface Logic — 49 I/O and 768 logic elements provide resources for glue logic, signal conditioning, and custom interface functions.

Unique Advantages

  • Compact, board-friendly package: 68-VFQFN (68-QFN, 8×8 mm) exposed-pad package enables dense PCB integration and reliable surface-mount assembly.
  • Industrial-rated operation: −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
  • Programmable capacity for mid-density designs: 768 logic elements and 30,000 gates offer a balanced mix of logic resources for custom digital implementations.
  • Defined low-voltage core support: 1.425 V to 1.575 V supply range aligns with modern low-voltage system architectures.
  • Compliance and supply chain confidence: RoHS-compliant device manufactured by Microchip Technology with published product documentation.

Why Choose A3P030-2QNG68I?

The A3P030-2QNG68I positions itself as a mid-density ProASIC3 FPGA offering a compact footprint, industrial temperature capability, and a clear set of core resources (768 logic elements, 30,000 gates, 49 I/O). It suits designs that need on-board programmable logic in a surface-mount 68-QFN package while operating across a broad temperature range.

Backed by Microchip Technology and accompanied by manufacturer documentation, this device is appropriate for engineers targeting robust, space-efficient programmable logic solutions in industrial and embedded applications.

Request a quote or submit an inquiry for pricing and availability of the A3P030-2QNG68I.

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