A3PN125-1VQG100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP |
|---|---|
| Quantity | 348 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN125-1VQG100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC 71 36864 100-TQFP
The A3PN125-1VQG100I is a ProASIC3 nano FPGA from Microchip Technology. It provides a compact, surface-mount programmable logic device with a defined set of logic, memory and I/O resources sized for embedded and industrial designs.
With 3,072 logic elements (approx. 125,000 gates), 71 I/Os and 36,864 bits of on-chip RAM, this device targets applications that require mid-density programmable logic in a 100-TQFP package and that must operate across industrial temperature ranges.
Key Features
- Core Logic 3,072 logic elements (reported) enabling up to 125,000 gates of user-defined logic for combinational and sequential functions.
- Embedded Memory 36,864 bits of on-chip RAM to implement small buffers, FIFOs or register storage directly in the fabric.
- I/O Count 71 general-purpose I/O pins to interface with external peripherals, sensors and buses within a compact package footprint.
- Power Supply Specified core supply range of 1.425 V to 1.575 V for deterministic power provisioning and design integration.
- Package and Mounting Surface-mount 100-TQFP package (supplier device package: 100-VQFP, 14×14 mm) for PCB assembly in space-conscious designs.
- Temperature and Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
- Compliance RoHS compliant to meet environmental and regulatory requirements for lead-free assembly.
Typical Applications
- Industrial Control Programmable logic for industrial systems where the device’s industrial temperature range and surface-mount package are required.
- Embedded Systems Integration of custom glue logic, protocol bridging or peripheral control using a mid-density logic resource set and 71 I/Os.
- Prototyping and Small-Volume Production Compact 100-TQFP packaging and mid-level resources make the device appropriate for prototype boards and low- to moderate-volume product runs.
Unique Advantages
- Balanced Logic Density: 3,072 logic elements and 125,000 gates provide a mid-range resource pool for a variety of control and glue-logic tasks without oversizing the solution.
- On-Chip Memory: 36,864 bits of embedded RAM reduce external memory needs for small buffers and state storage, simplifying board design.
- Generous I/O Count: 71 I/Os enable flexible interfacing to peripherals and sensors without immediate reliance on external expanders.
- Industrial Readiness: Rated for −40 °C to 100 °C and identified as industrial grade, supporting deployment in harsher operating environments.
- Compact, Assembly-Friendly Package: Surface-mount 100-TQFP (14×14 mm supplier package) supports standard PCB assembly flows for compact products.
- Regulatory Compliance: RoHS compliance helps meet lead-free assembly and environmental objectives.
Why Choose A3PN125-1VQG100I?
The A3PN125-1VQG100I combines a mid-density logic fabric, on-chip RAM and a high I/O count in a compact 100-TQFP surface-mount package, making it suitable for designers seeking a reliable programmable-logic building block for industrial and embedded applications. Its specified core voltage range and industrial operating temperature support integration into controlled-power and rugged environments.
For projects that require a pragmatic balance of logic resources, embedded memory and I/O capability in a mountable TQFP package, this ProASIC3 nano device offers a clear, verifiable specification set to base system-level decisions on.
Request a quote or submit an inquiry to receive pricing and availability for the A3PN125-1VQG100I.

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