A40MX02-1PLG68M

IC FPGA 57 I/O 68PLCC
Part Description

MX Field Programmable Gate Array (FPGA) IC 57 68-LCC (J-Lead)

Quantity 821 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Device Package68-PLCC (24.23x24.23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case68-LCC (J-Lead)Number of I/O57Voltage3 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs295Number of Logic Elements/Cells295
Number of Gates3000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/A

Overview of A40MX02-1PLG68M – MX Field Programmable Gate Array (FPGA) IC, 57 I/O, 68-LCC (J-Lead)

The A40MX02-1PLG68M is an MX-family Field Programmable Gate Array (FPGA) from Microchip Technology supplied in a 68‑lead LCC (J‑Lead) surface-mount package. It provides a compact, programmable logic solution with 57 general-purpose I/O pins for medium-complexity designs.

With 295 logic elements (approximately 3,000 gates), a wide supply range of 3 V to 5.5 V, military-grade qualification and an operating temperature range of −55 °C to 125 °C, this device is targeted at rugged and long-life embedded applications that require deterministic custom logic and robust environmental performance.

Key Features

  • Core Logic  Provides 295 logic elements (about 3,000 gates) suitable for low- to mid-density custom logic and glue‑logic implementations.
  • I/O Capacity  57 user I/O pins offer flexible interfacing for sensors, peripherals and control signals in compact systems.
  • Power Supply Range  Operates from 3 V to 5.5 V, enabling use in systems with a range of industry-standard supply rails.
  • Temperature & Grade  Military grade device rated for −55 °C to 125 °C operation, addressing demanding environmental requirements.
  • Package & Mounting  68‑lead LCC (J‑Lead) surface-mount package (supplier package: 68‑PLCC, 24.23 × 24.23 mm) for through‑board space efficiency and established assembly workflows.
  • Compliance  RoHS compliant for environmental and regulatory alignment in modern production processes.
  • On‑chip Memory  This device contains no on-chip RAM, simplifying memory planning for designs that use external memory resources.

Typical Applications

  • Military and Aerospace Electronics  Suitable for rugged avionics and defense systems thanks to military-grade specification and extended temperature operation.
  • Embedded Control and Glue Logic  Ideal for custom control functions, protocol bridging and glue logic where moderate gate count and flexible I/O are required.
  • Industrial and Instrumentation  Useful in test, measurement and industrial control gear that require reliable operation across wide temperature ranges.

Unique Advantages

  • Extended Temperature Capability: Rated from −55 °C to 125 °C to support deployments in harsh thermal environments.
  • Flexible Supply Range: 3 V to 5.5 V operation allows integration into systems using common legacy and modern supply rails.
  • Compact Surface‑Mount Package: 68‑lead LCC (J‑Lead) surface-mount form factor conserves board space while providing ample I/O.
  • Programmable Logic Density: 295 logic elements (≈3,000 gates) give designers the ability to implement custom finite-state machines, I/O mapping and control logic without added ASIC development.
  • RoHS Compliance: Environmentally compliant manufacturing compatibility for modern production standards.

Why Choose A40MX02-1PLG68M?

The A40MX02-1PLG68M positions itself as a rugged, compact FPGA option for designs that require deterministic custom logic, flexible I/O and operation across extreme temperatures. Its combination of 295 logic elements, 57 I/O pins and broad supply range makes it well suited for embedded control, military/aerospace and industrial systems that prioritize reliability and long-term availability.

For engineers specifying solutions that must balance programmable functionality with environmental robustness, this device offers a straightforward integration path and predictable electrical and thermal characteristics backed by Microchip Technology’s MX family architecture.

If you need pricing, lead-time or technical availability, request a quote or submit your requirements and a sales specialist will provide pricing and availability information.

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