A40MX02-1PLG68M
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 57 68-LCC (J-Lead) |
|---|---|
| Quantity | 821 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 68-PLCC (24.23x24.23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 68-LCC (J-Lead) | Number of I/O | 57 | Voltage | 3 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 295 | Number of Logic Elements/Cells | 295 | ||
| Number of Gates | 3000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A40MX02-1PLG68M – MX Field Programmable Gate Array (FPGA) IC, 57 I/O, 68-LCC (J-Lead)
The A40MX02-1PLG68M is an MX-family Field Programmable Gate Array (FPGA) from Microchip Technology supplied in a 68‑lead LCC (J‑Lead) surface-mount package. It provides a compact, programmable logic solution with 57 general-purpose I/O pins for medium-complexity designs.
With 295 logic elements (approximately 3,000 gates), a wide supply range of 3 V to 5.5 V, military-grade qualification and an operating temperature range of −55 °C to 125 °C, this device is targeted at rugged and long-life embedded applications that require deterministic custom logic and robust environmental performance.
Key Features
- Core Logic Provides 295 logic elements (about 3,000 gates) suitable for low- to mid-density custom logic and glue‑logic implementations.
- I/O Capacity 57 user I/O pins offer flexible interfacing for sensors, peripherals and control signals in compact systems.
- Power Supply Range Operates from 3 V to 5.5 V, enabling use in systems with a range of industry-standard supply rails.
- Temperature & Grade Military grade device rated for −55 °C to 125 °C operation, addressing demanding environmental requirements.
- Package & Mounting 68‑lead LCC (J‑Lead) surface-mount package (supplier package: 68‑PLCC, 24.23 × 24.23 mm) for through‑board space efficiency and established assembly workflows.
- Compliance RoHS compliant for environmental and regulatory alignment in modern production processes.
- On‑chip Memory This device contains no on-chip RAM, simplifying memory planning for designs that use external memory resources.
Typical Applications
- Military and Aerospace Electronics Suitable for rugged avionics and defense systems thanks to military-grade specification and extended temperature operation.
- Embedded Control and Glue Logic Ideal for custom control functions, protocol bridging and glue logic where moderate gate count and flexible I/O are required.
- Industrial and Instrumentation Useful in test, measurement and industrial control gear that require reliable operation across wide temperature ranges.
Unique Advantages
- Extended Temperature Capability: Rated from −55 °C to 125 °C to support deployments in harsh thermal environments.
- Flexible Supply Range: 3 V to 5.5 V operation allows integration into systems using common legacy and modern supply rails.
- Compact Surface‑Mount Package: 68‑lead LCC (J‑Lead) surface-mount form factor conserves board space while providing ample I/O.
- Programmable Logic Density: 295 logic elements (≈3,000 gates) give designers the ability to implement custom finite-state machines, I/O mapping and control logic without added ASIC development.
- RoHS Compliance: Environmentally compliant manufacturing compatibility for modern production standards.
Why Choose A40MX02-1PLG68M?
The A40MX02-1PLG68M positions itself as a rugged, compact FPGA option for designs that require deterministic custom logic, flexible I/O and operation across extreme temperatures. Its combination of 295 logic elements, 57 I/O pins and broad supply range makes it well suited for embedded control, military/aerospace and industrial systems that prioritize reliability and long-term availability.
For engineers specifying solutions that must balance programmable functionality with environmental robustness, this device offers a straightforward integration path and predictable electrical and thermal characteristics backed by Microchip Technology’s MX family architecture.
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