A40MX02-3VQG80I
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 57 80-TQFP |
|---|---|
| Quantity | 1,504 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 80-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 80-TQFP | Number of I/O | 57 | Voltage | 3 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 295 | Number of Logic Elements/Cells | 295 | ||
| Number of Gates | 3000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A40MX02-3VQG80I – MX Field Programmable Gate Array (FPGA) IC 57 I/O 80‑TQFP
The A40MX02-3VQG80I is a field programmable gate array (FPGA) in an 80‑lead TQFP package designed for industrial applications. It provides a compact, surface-mount logic fabric with 295 logic elements, 57 general-purpose I/O pins and support for 3 V to 5.5 V supplies, enabling flexible integration into space-constrained embedded systems.
With an operating temperature range of -40 °C to 85 °C and RoHS compliance, this device targets robust designs that require programmable logic, a small gate count (3,000 gates) and a standard 14 × 14 mm package footprint.
Key Features
- Core Logic 295 logic elements (LAB/CLB equivalent) providing approximately 3,000 gates of user-programmable logic for glue logic, protocol conversion and small to moderate combinatorial/sequential designs.
- I/O Capacity 57 available I/O pins supporting a range of external interfaces and signal connections in a compact package.
- Memory No on-chip RAM (Total RAM Bits = 0), suitable for designs that rely on distributed logic or external memory resources.
- Power Wide supply range from 3 V to 5.5 V to accommodate common embedded power rails and legacy signaling levels.
- Package & Mounting 80‑lead TQFP (supplier package listed as 80‑VQFP, 14 × 14 mm) in a surface-mount form factor for standard PCB assembly processes.
- Temperature & Grade Industrial grade operation with specified temperature range of -40 °C to 85 °C for use in demanding environments.
- Compliance RoHS‑compliant construction for regulatory and environmental compatibility.
Typical Applications
- Industrial Control Use the FPGA’s 295 logic elements and 57 I/Os to implement custom control logic, interface conditioning and protocol bridging in industrial automation equipment.
- Embedded System Glue Logic Ideal for board-level integration where programmable logic replaces discrete components for address decoding, timing control and peripheral interfacing.
- Sensor and I/O Aggregation Combine multiple sensor signals and implement pre-processing or signal multiplexing using the device’s I/O density and programmable logic.
Unique Advantages
- Compact, standard package: The 80‑lead TQFP (14 × 14 mm) delivers a high pin count in a space-efficient surface-mount footprint, easing PCB layout in constrained designs.
- Flexible supply voltage: Support for 3 V to 5.5 V supplies enables compatibility with a wide range of embedded power architectures and I/O voltage domains.
- Industrial temperature range: Specified operation from -40 °C to 85 °C makes the device suitable for long-term deployment in industrial environments.
- Programmable logic capacity: 295 logic elements and ~3,000 gates provide a ready platform for implementing custom finite-state machines, protocol handling and interface logic.
- RoHS compliance: Environmentally compliant design simplifies integration into regulated manufacturing flows.
Why Choose A40MX02-3VQG80I?
The A40MX02-3VQG80I combines a compact TQFP package, industrial temperature rating and a practical balance of logic density and I/O count to serve embedded and industrial designs that require reliable, programmable logic without large silicon footprints. Its support for 3 V to 5.5 V supplies and 57 I/Os makes it a straightforward choice for board-level glue logic, control tasks and I/O aggregation where on-chip RAM is not required.
For teams designing space-conscious, industrial-grade systems that need a verified FPGA building block with clear electrical and thermal characteristics, this device provides predictable, verifiable specifications and RoHS compliance to support production deployment.
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