A40MX02-PQ100A

IC FPGA 57 I/O 100QFP
Part Description

MX Field Programmable Gate Array (FPGA) IC 57 100-BQFP

Quantity 836 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-PQFP (20x14)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case100-BQFPNumber of I/O57Voltage3 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs295Number of Logic Elements/Cells295
Number of Gates3000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100

Overview of A40MX02-PQ100A – MX Field Programmable Gate Array (FPGA) IC 57 100-BQFP

The A40MX02-PQ100A is an MX Field Programmable Gate Array (FPGA) from Microchip Technology delivered in a 100-BQFP package. It provides a moderate logic density FPGA fabric with 295 logic elements and 3,000 gates, alongside 57 general-purpose I/O pins for configurable interfacing.

Designed for use in automotive and embedded control applications, this device offers AEC-Q100 qualification, a wide operating temperature range from −40 °C to 125 °C, and a flexible supply range of 3 V to 5.25 V for varied system environments.

Key Features

  • Core Logic  295 logic elements (reported as 295 CLBs) delivering 3,000 gates for implementing custom digital logic and glue functions.
  • I/O  57 user I/O pins suitable for multi-signal interfacing and mid-density connectivity on board-level designs.
  • Memory  Total on-chip RAM bits: 0 (no dedicated embedded RAM reported).
  • Supply Voltage  Operates from 3 V to 5.25 V to support a range of system voltage domains and legacy interfaces.
  • Package and Mounting  Supplied in a 100-BQFP package; supplier device package listed as 100-PQFP (20x14). Surface mount device suitable for standard PCB assembly.
  • Automotive Qualification & Temperature  Grade: Automotive with AEC-Q100 qualification; specified operating temperature range −40 °C to 125 °C for demanding thermal environments.
  • Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

  • Automotive Control Modules  AEC-Q100 qualification and wide temperature range make this FPGA suitable for configurable logic tasks in automotive electronic control modules.
  • Embedded System Glue Logic  Use the device to implement custom bus bridging, protocol conversion, and timing adaptation between subsystems.
  • Interface Consolidation  With 57 I/O pins and flexible supply voltage support, it can consolidate multiple discrete functions into a single programmable device.

Unique Advantages

  • Automotive-ready qualification: AEC-Q100 qualification supports deployment in automotive electronics where qualification is required.
  • Wide operating temperature: −40 °C to 125 °C rating enables use across harsh thermal environments without derating of the specified range.
  • Flexible supply range: 3 V to 5.25 V operation allows direct interfacing with a variety of logic families and system voltages.
  • Mid-density logic integration: 295 logic elements and 3,000 gates provide compact programmable logic for glue, control, and custom functions.
  • Compact package options: 100-BQFP / supplier-listed 100-PQFP (20x14) packages support space-constrained PCB designs and surface-mount assembly.
  • Regulatory compliance: RoHS compliance simplifies environmental conformity for production programs.

Why Choose A40MX02-PQ100A?

The A40MX02-PQ100A positions itself as a reliable mid-density programmable logic option for designers who need configurable functionality with automotive-grade qualification. Its combination of 295 logic elements, 57 I/Os, AEC-Q100 qualification, and a wide operating temperature and supply range makes it appropriate for embedded and automotive applications that require robust, configurable logic without high on-chip memory requirements.

Manufactured by Microchip Technology and supplied in a compact 100-pin package, the device is suitable for projects prioritizing integration, temperature resilience, and supply flexibility. It serves teams building scalable, long-lived designs that benefit from a configurable FPGA element within constrained PCB footprints.

Request a quote or submit an inquiry for pricing and availability to get component details and lead-time information for your design needs.

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